Wearable Device

For low power application in wearable devices, Winbond provide 1.8V Serial Flash and Know Good Die for SiP solution and WLCSP(Wafer-Level Chip Scale Package) product to fit small form factor is highly suggested.

Smart Home

For smart home application , Winbond provide industrial grade 1.8V Serial Flash and Know Good Die for SiP solution as highly trusted code storage memories.