Milestones
2008
| Date |
Milestones |
| Jun/2008 |
Winbond Electronics Corporation Signed a NT$ 7.7 Billion Syndicated Loan Agreement with 11 Domestic Banks. |
| Apr/2008 |
Winbond Regular Shareholders’ Meeting Approves the Carve-Out of its Logic IC Business named Nuvoton Technology Corporation. |
| Apr/2008 |
Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 65 nanometer Buried Wordline Technology Transfer. |
2007
| Date |
Milestones |
| Nov/2007 |
Winbond is awardwed "2007 The Efficiency to operate Pre-dispose of Sewerage System in CTSP Execllent Award" by the Central Taiwan Science Park (CTSP). |
| Nov/2007 |
Winbond is awardwed "2007 Eco – Technology Conference paper first prize " by the Industrial Development Bureau Ministry of Economic Affairs. |
| Nov/2007 |
Winbond is awardwed “Green House Gases Voluntary Reduction Award” by Industrial Development Bureau of the Ministry of Economic Affairs. |
| Sep/2007 |
Winbond signed a NT$ 5 billion syndicated loan agreement with 8 domestic banks. |
| Aug/2007 |
Winbond obtained 2-year renewal of SONY Green Partner (GP) certification. |
| Jun/2007 |
Winbond CTSP Site passed ISO 14000 and OHSAS 18000 certification. |
| Jun/2007 |
Winbond passed BSI’s (British Standards Institution) certification on Greenhouse Gases Emissions Verification. |
| Jun/2007 |
Volume production of T80 had started. |
| Jun/2007 |
Winbond and Qimonda AG Announced A New Agreement for 75nm and 58nm Technology Transfer. |
| Apr/2007 |
Winbond received "the Outstanding Performance for Dangerous Chemical Examination
And Data Establishment Award" from the Central Taiwan Science Park (CTSP). |
| Mar/2007 |
Winbond introduced industry’s first 64M DDR KGD and successfully led into market. |
| Mar/2007 |
Winbond Receviced Friendly Workplace Certification from Council of Labor Affairs. |
| Mar/2007 |
Winbond Sold 200mm fab to VIS. |
2006
| Date |
Milestones |
| Dec/2006 |
Winbond acquired land and will build R&D building close to the High-Speed Rail ChuPei Station. |
| Dec/2006 |
Winbond won the "Copper Tower Award" from the 19th National Quality Control Circle Competition. |
| Nov/2006 |
Winbond Invested USD 15.7 Million to Emerging Memory & Logic Solution, Inc. |
| Aug/2006 |
Winbond Electronics Corporation and Qimonda AG Signed A New Agreement for Technology Transfer. |
| Aug/2006 |
Winbond adjusted its corporate culture to Accountability, Innovation, and Teamwork. The slogan has been adjusted to We deliver. |
| Jun/2006 |
Fab 6 received the highest award of AIG triple star status for risk management assessment and Fab 4 has earned the same prestigious award two years in a row. |
| May/2006 |
Winbond issued USD 120 million euro-convertible bond with a zero percent coupon and a conversion premium of twenty-five percent. |
| Apr/2006 |
Winbond held the grand opening ceremony for its 12-inch fabrication plant at Central Taiwan Science Park. |
| Jan/2006 |
Winbond sold its FPD (Flat Panel Display) business to Cheertek Technology Inc. |
2005
| Date |
Milestones |
| Dec/2005 |
Winbond received, "The 2005 Outstanding Performance for Water Conservation Award" from the Water Resources Bureau, MOEA. |
| Oct/2005 |
Winbond was awarded the, " 2005 Outstanding Atmosphere Protection Award" by the Association of Atmosphere Protection in Taiwan (AAPT). |
| Oct/2005 |
Winbond Electronics Corporation signed a NT$ 15 Billion Syndicated Loan. |
| Sep/2005 |
The 12-inch fab in the Central Taiwan Science Park entered into mass production stage. |
| Jul/2005 |
Winbond Injected USD 20 Million Capital to WEC Investment Holding Ltd. |
| Jun/2005 |
Winbond signed a four-year syndicated loan agreement in the amount of US$ 70 million. |
| Jun/2005 |
Winbond acquired NexFlash Technology. |
| Jun/2005 |
The Board of Directors of Winbond created two new positions of Chief Executive Officer (CEO) and Deputy Chief Executive Officer. |
| Jun/2005 |
Clean room of Fab 6 was ready and the equipments have moved in.. |
| May/2005 |
Fab 4 Fully achieved the AIG Triple Star Status. |
| May/2005 |
Successful mass production of first single-chip Multimedia A/V Processor IC with 0.13-micron process technology in Taiwan. |
| Apr/2005 |
Winbond acquired the Advanced PC Business Division from National Semiconductor. |
| Jan/2005 |
Winbond signed a five-year syndicated loan agreement in the amount of NT$ 8 billion. |
| Jan/2005 |
Fab 6 won the prestigious, “2004 Environmental protection & Safety in Construction Award” from the Central Taiwan Science Park. |
2004
| Date |
Milestones |
| Dev/2004 |
Winbond held the Upper beam placement ceremony for the 12 inch fabrication plant at Central Taiwan Science Park. |
| Dec/2004 |
As a research of "Fluorine-ion Reduction from the Neutralizing System", Winbond won the Honorable Mention in 2004 Semiconductor and Opto-electronics Facility Seminar. |
| Sep/2004 |
Winbond won the "Silver Tower Award" from the 17th National Quality Control Circle Competition. |
| Jul/2004 |
Winbond held the ground breaking ceremony for the 12 inch fabrication plant at Central Taiwan Science Park. |
2003
| Date |
Milestones |
| Dev/2003 |
Winbond wins the prestigious, “2002 Science Industrial Park Research & Development Award”. |
| Nov/2003 |
Fab4 earned the prestigious, "2002 National Labor Safety and Award", two years in a row. |
| Oct/2003 |
Fab 2 is awarded the highest honor, "Outstanding Environmental Protection Award" issued by the Environmental Protection Administration, three years in a row. |
| Oct/2003 |
Fab 2 earned the prestigious, "2002 Science Industrial Park Labor Safety Award". |
| Jun/2003 |
Winbond announces successful results for mass production of its 0.13-micron 32Mb WinStack Flash products. |
| Jun/2003 |
Winbond establishes a new technology R&D group composed of three centers: Memory Technology Center, Emerging Technology Center and Novel Device Structure Center. |
| May/2003 |
Winbond introduces a supply chain integrated supply chain system, " SWORD" Satisfaction of Winbond Order Response & Delivery to enhance the quality of customer service and flexibility of production. |
2002
| Date |
Milestones |
| Nov/2002 |
Fab 2 is awarded the, "Outstanding Environmental Protection Award" issued by the Environmental Protection Administration two years in a row. |
| Oct/2002 |
Fab 2 received, "The Best Performance for Waste Minimization Factory Award". |
| Oct/2002 |
Fab4 earned the prestigious, "2001 National Labor Safety and Award". |
| Oct/2002 |
Received the National Invention Award from The Intellectual Property Office of MOEA. |
| Oct/2002 |
Captured the gold medal in the category of "High density CMP waste water Recycling" for MOEA's 15th Annual Activities competition. |
| Sep/2002 |
Introduced the industry's first non-volatile potentiometer chip featuring selectable output buffer. |
| Aug/2002 |
The Company announces the successful results of testing, along with excellent yield rates, for its 0.18-Micron, 32M WinStack Flash technology program. |
| Jun/2002 |
Fab1, a 5-inch facility, is formally retired. The Fab was the Company’s very first fab facility. |
| Jun/2002 |
Winbond Electronics Shanghai Ltd., is honored as, “ Foreign Investment Enterprise for Advanced Technology" by the Shanghai Foreign Investment Commission and the Shanghai Foreign Economic Relations & Trade Commission. |
| May/2002 |
Winbond Electronics Corporation signs strategic alliance with Infineon Technologies AG for joint development of 0.11-Micron DRAM technology. |
| Mar/2002 |
The Company exhibits its innovative and environmentally advanced ultra pure water system and recycling system, sponsored by SIPA. |
| Jan/2002 |
Open house held for Winbond’s technology building. |
2001
| Date |
Milestones |
| Dec/2001 |
The company achieves DNV OHSAS 18001 certification. |
| Dec/2001 |
WECA achieved QS-9000 certification. |
| Dec/2001 |
The Company announces the results of successful testing and excellent yield rates for its 0.13-micron 512M SDRAM/DDR ICs. |
| Nev/2001 |
China’s Shanghai Information Office classifies Winbond Electronics Shanghai Ltd., as a, “IC Design Company”. |
| Nev/2001 |
Winbond and Sharp Corporation establish a joint development program for Advanced Contactless Technology Flash. |
| Oct/2001 |
WECA launched the WTS701, the industry's first true text-to-speech single chip processor. |
| Oct/2001 |
Fab 4 earned the prestigious, "2001 Science Industrial Park Labor Safety Award", two years in a row . |
| Oct/2001 |
Winbond receives the, "The Best Performance for Waste Minimization Award" hosted by the Industrial Development Bureau, MOEA. |
| Oct/2001 |
Fab 2 received, "The Best Performance of Waste Minimization Factory Award" hosted by the Industrial Development Bureau, MOEA. The award follows the same honor given to Fab 4. |
| Oct/2001 |
Fab 4 is awarded the, "Outstanding Environmental Protection Award" issued by the Environmental Protection Administration. The award follows the same honor given to Fab 4. |
| Oct/2001 |
Winbond captures a gold medal in the productioncategory for MOEA's 14th annual Group Activities competition. |
| Oct/2001 |
Winbond establishes a new company, "Cheertek Incorporation" dedicated to multimedia IC development. |
| Sep/2001 |
Winbond establishes a representative’s office in Shenzhen, China. |
| Jul/2001 |
Winbond licenses Mobile-Fast Cycle Random Access Memory technology from Fujitsu Limited. |
| Jun/2001 |
The Company’s Knowledge Management Center holds its first, "Best Practice Competition". More than 70 participants from the Company’s product design and fabrication component groups competed for two Golden, three Silver, four Bronze and seven Excellence in Work awards, with prizes worth a total of NT $590,000. |
| Jun/2001 |
The Company achieves new patent milestone; exceeding more than 1000 patents held worldwide. |
| May/2001 |
The Corporation earns the, "Total Productive Maintenance (TPM)" award hosted by the Industrial Development Bureau of Ministry and Economic Affairs. |
| May/2001 |
Winbond receives Golden Award from the Council for Cultural Affairs. |
| May/2001 |
The company introduces a new series of Double Data-Rate 256M DRAM Chips. |
| Apr/2001 |
Winbond receives, "The Outstanding Performance for Water Conservation Award" from the Water Resources Bureau, MOEA. |
| Apr/2001 |
Winbond cooperates with Center for Environmental, Safety and Health Technology Development, ITRI, to develop an innovative air pollution control process for eliminating volatile organic compounds in exhaust. The process, a combination of ozone oxidation and a wet scrubber, is part of a project sponsored by HsinChu Science-Cased Industrial Park for innovative high-tech R&D projects ductor. |
| Mar/2001 |
The Company’s wholly-owned subsidiary, "ISD Israel Ltd." changes its name to "Winbond Electronics Corporation Israel Ltd.." |
| Mar/2001 |
Winbond Electronics Shanghai Ltd., is established. |
| Jan/2001 |
Winbond Electronics Corporation Japan, is established. |
| Jan/2001 |
The Company signs a Letter of Intent for investing in NexFlash Technologies, Inc. |
2000
| Date |
Milestones |
| Dec/2000 |
Winbond wins the prestigious, “2000 Science Industrial Park Research & Development Award”. |
| Nov/2000 |
The first computer integrated manufacturing system for Fab 5 is completed. |
| Nov/2000 |
The Company hosts its first sports meet and recreational fair. |
| Oct/2000 |
Winbond Electronics Hong Kong (WEHK) and WECA successfully launches a financial and accounting system, “SAP/R3 FI and CO”. |
| Sep/2000 |
The Company successfully launches a new performance evaluation data system, “KPI+BW”. |
| Aug/2000 |
Winbond Electronics Corporation America (WECA) successfully launches a series of new 8-bit micro controllers, the W78LE58 and W78LE516 in the United States and Europe. |
| Jul/2000 |
The Corporation successfully launches a new financial and accounting system, "SAP/R3 FI and CO”. |
| Jul/2000 |
Winbond ships the world’s first single chip ISDN S/T controller for USB TA applications. |
| Jul/2000 |
The Company’s speech recognition Winbond SimonTM chip solution “SR3000” wins L’ECTRON D’OR 2000, product of the year award. |
| Jun/2000 |
Tsuyoshi Kawanishi is named as the Company’s newest board member. |
| Jun/2000 |
The Corporation establishes a new, "Fab Automation & Facility Engineering Center". The new center is a strategic part of the Company's new 12-inch Fab program and is tasked with integrating automation and project management. |
| Jun/2000 |
Winbond establishes a new, "Quality & SHE Center" (Quality and Reliability Assurance, Safety, Health & Environment Center"). |
| Jun/2000 |
Winbond establishes a new, "Knowledge Management Center" to address new global economic business issues and to enhance management of its extensive intellectual property. |
| May/2000 |
Winbond obtains 5.1 channel 20 bit AC-3 certification from Dolby Laboratories Licensing Corporation for its W9922QF DVD decoder. |
| May/2000 |
Winbond signs a joint technology agreement with Fujitsu and Toshiba. The three companies will develop advanced 0.13-micron DRAM manufacturing processes as well as further develop a new generation of 0.11-micron DRAM manufacturing technology. |
| Apr/2000 |
Winbond signs a cooperative technology development agreement with Toshiba for developing 0.13-micron trench DRAM technology. |
| Mar/2000 |
The Company's Business Group 1 achieves QS 9000 certification. |
1999
| Date |
Milestones |
| Dec/1999 |
Attained record-breaking annual revenues with a new high of NT $31 billion. |
| Dec/1999 |
Achieved record-high sales revenues for a single month from Japan in the amount of NT $200 million. |
| Dec/1999 |
Won the prestigious, "1999 Science Industrial Park Research & Development Award." |
| Dec/1999 |
Successfully introduced Taiwan's first 0.175Micron process technology for 256Mb DRAM products. |
| Nov/1999 |
Successfully launched a new automatic material handling system for Fab 4 and Fab 5. |
| Nov/1999 |
Received award for, "The Best Performing Electronics Corporation" in the, "1999 Outstanding Electronic Component Suppliers Contest". Winbond wins first place in product innovation, product quality, service quality, best performance and second place in the corporate image category. |
| Oct/1999 |
Granted the Company's 500th patent . |
| Sep/1999 |
Commenced rapid recovery operation through collaborative company-wide efforts after being struck by a powerful earthquake. |
| Aug/1999 |
Signed a technology and licensing agreement with Vivid Semiconductor regarding TFT-LCD driver and controller IC. |
| Jun/1999 |
Become gold medal winner of the 8th R.O.C. Patent Award. |
| Apr/1999 |
Successfully acquired the TFT LCD driver of Cirrus Logic. |
| Mar/1999 |
Toshiba technical alliance in 0.175 and 0.15 micron DRAM process technologies. |
| Mar/1999 |
Entered 1998 Top 300 companies list for granted patents at U.S. Patent Office. |
| Jan/1999 |
Rambus Technical license and sampled 1.6 GB/sec memory devices in Q3 1999. |
1998
| Date |
Milestones |
| Dec/1998 |
Dr. Ding-Yuan Yang promoted as vice chairman and Dr.Ching-Chu Chang become president. |
| Dec/1998 |
Received Science Park R&D Investment Award. |
| Dec/1998 |
Patents certificate reached 350 worldwide. |
| Dec/1998 |
FAB 1 and FAB 2 passed ISO 14001 certification. |
| Dec/0998 |
Acquired Information Storage Devices, Inc. (ISD), supplier of advanced voice IC and flash memory product. |
| Dec/1998 |
Awarded by the Hsinchu County for outstanding performance of foreign laborer management. |
| Dec/1998 |
0.25 micron SDRAMs passed Toshiba qualification. |
| Nov/1998 |
200 million shares capital rise for Global Depositary Receipts (GDR). |
| Nov/1998 |
Added SMSC as representative in North America and Europe market. |
| Nov/1998 |
W9926QF Super VCD Chipset in compliance with Mainland China national standard. |
| Oct/1998 |
Joint-development of CHISEL technology with Lucent. |
| Oct/1998 |
64M DRAMs of 0. 25 micron process technology commercial run complete. |
| Sep/1998 |
Rambus technology transfer. |
| Jul/1998 |
64M DRAMs of 0. 35 micron process technology commercial run complete. |
| Jun/1998 |
Started the distributive education plan and donation of advanced manufacturing equipment for R&D with National Tsing-Hua University. |
| Jun/1998 |
Invested in Walton Advanced Electronics Ltd. |
| Jun/1998 |
Vice President Lien- Chan hosted the open house ceremony for FAB 4. |
| Jun/1998 |
Welfare committee won" 1998 Enterprise Welfare Innovation Award." |
| Jun/1998 |
Winbond Newsletter awarded "the 1998 Outstanding Employee's periodical of Taiwan. |
| Jun/1998 |
The first EPROM product with 0.5 micron N.V.M. technology process introduction |
| Jun/1998 |
0.5 micron Mixed -Mode process technology transferred to Worldwide Semiconductor Manufacturing Corporation. |
| Jun/1998 |
FAB 2 achieved the honor as the" One-Year Exemption Protection Program" by the Council of Labor Affairs of the Executive Yuan. |
| May/1998 |
64M DRAMs of 0. 25 micron process technology pilot run complete. |
| May/1998 |
DRAMs were first qualified by domestic notebook companies. |
| May/1998 |
0.4 micron Flat Cell Speech IC introduction. |
| May/1998 |
0.4 micron Logic MPEG chip introduction. |
| Apr/1998 |
Issued a NTD 6 billion domestic convertible bond. |
| Arp/1998 |
Introducing 0.6-micron Embedded Flash Speech IC. |
| Mar/1998 |
FAB 3 clean up project complete, FAB 5 project began. |
1997
| Date |
Milestones |
| Nov/1997 |
FAB 4 began Toshiba transferred 64M DRAMs pilot run with satisfactory yield and world claim quality. |
| Nov/1997 |
FAB 2 received award for "the Achievement of 1997 Pollution Prevention Equipment Operation and Maintenance" by the Industrial Development Bureau ministry of Economic Affairs. |
| Nov/1997 |
Successfully issued 5 -year USD 100 million dual-tranche Euro-convertible bonds at NTD 49.12 per share. |
| Oct/1997 |
Toshiba strategic alliance for 0.25 micron Embedded DRAMs. |
| Oct/1997 |
FAB 1 achieved Two-Year Protection Program exemption issued by the Council of Labor Affairs of the Executive Yuan. |
| Oct/1997 |
Launched IEF system to integrate Extranet-Internet-Intranet. |
| Aug/1997 |
Launched DAM,DMS on-line services toward paperless document control. |
| Jul/1997 |
Become the second largest SRAMs supplier of Compaq Computer, 2Q 1997. |
| Jun/1997 |
Successfully developed advanced 0.4 micron 4T SRAMs and increased gross die of 2M SRAMs by 30%. |
| Jun/1997 |
Introducing 0.6 micron Digital Embedded Flash Memory, alliance with Information Storage Devices, Inc. (ISD) to produce voice recording IC. |
| Jun/1997 |
Awarded by the Ministry of Economic Affairs for the outstanding performance of IP management. |
| May/1997 |
Introducing 0.35 micron logic MPEG. |
| May/1997 |
Received Silver National Award of Excellence of '97 for W9960 Video Processing Chipset. |
| Apr/1997 |
FAB2 achieved "A Grade" of Pollution Prevention Voluntary Audit by the Environmental Protection Bureau of Hsinchu. |
1996
| Date |
Milestones |
| Dec/1996 |
Awarded by the Executive Yuan as the "1996 Outstanding Private Enterprise Providing Good Working Environment. |
| Dec/1996 |
W9925PF MPEG-1Video, Audio and System Decoder winning the "1996 Science Industrial Park Product Creativity Award." |
| Nov/1996 |
Acquiring ROC circuit deployment right #00001. |
| Nov/1996 |
Introducing multiprotocol video processor. |
| Oct/1996 |
FAB III suffered fire loss. |
| Oct/1996 |
Winning "1996 Science Industrial Park Research & Development Award." |
| Aug/1996 |
Signing 0.35 micron 64M DRAM technology transfer agreement with Toshiba. |
| May/1996 |
Providing OEM service for SGS-Thomson, the first OEM business client in Europe. |
| May/1996 |
Introducing 0.4 micron SRAMs. |
| May/1996 |
Upper beam placement ceremony for FAB III. |
| Apr/1996 |
Winbond Family & Housing Project breaking ground. |
| Mar/1996 |
Issuance of overseas convertible corporate bond at USD 200 million. |
| Feb/1996 |
Winning "Outstanding Environmental Protection Enterprise Award" issued by Hsinchu County Government. |
| Feb/1996 |
Winning "Outstanding Industrial Technology Development Award" issued by the Technical Development Department, MOEA. |
| Feb/1996 |
Acquiring loan agreement for FAB III at NTD14 billion. |
1995
| Date |
Milestones |
| Dec/1995 |
Licensing agreement with the Toshiba Corporation to design and produce 16 M DRAMs and new-generation high-speed SRAMs. |
| Dec/1995 |
W9920SF MPEG-1 Video Scaling Decoder garnered Science Park's1995 Innovative Product Award. |
| Dec/1995 |
Earned 1995 Science Park R & D Investment Award. |
| Oct/1995 |
Captured gold medal in production category in the MOEA's 8th Group Activities competition. |
| Oct/1995 |
Successfully completed initial public offering of Winbond stock. |
| Jun/1995 |
Developed 0.45 micron process technology. |
| Jun/1995 |
Began construction of Fab III. |
| Apr/1995 |
Commended by R.O.C.. Labor Commission for outstanding labor-management relations. |
| Apr/1995 |
Commended by National Industry Association for outstanding performance in energy conservation. |
| Mar/1995 |
MPEG image decoder chip set captured Gold National Award of Excellence. |
| Mar/1995 |
Received 1995 Gold Trade Award. |
1994
| Date |
Milestones |
| Dec/1994 |
Received Science Park's 1994 R & D Investment Award. |
| Dec/1994 |
MPEG image decoder IC and 32-bit PA-RISC microprocessor both earned Science Park Innovative Product awards. |
| Dec/1994 |
Received award for outstanding performance in development of industrial technology. |
| Nov/1994 |
Commended by National Business Association for outstanding performance in professional training. |
| Nov/1994 |
Commended by National Industry Association for outstanding performance in development and training of human resources. |
| Aug/1994 |
Fab II began production of 0.5 micron high-speed SRAMs. |
| Apr/1994 |
Commended by MOEA for outstanding performance in energy conservation. |
| Apr/1994 |
Developed 32-bit PA-RISC microprocessor. |
| Mar/1994 |
Introducing Asia's first MPEG chip. |
| Mar/1994 |
Developed 0.5 VLSI circuit process technology. |
| Mar/1994 |
Developed Asia's first single-chip MPEG image decoder IC. |
1993
| Date |
Milestones |
| Dec/1993 |
Power Speech intelligent speech synthesis IC earned Science Park Innovative Product Award. |
| Dec/1993 |
Received Science Park R&D Investment Award. |
| Nov/1993 |
Commended by National Industry Association and MOEA for outstanding performance in pollution prevention. |
| Nov/1993 |
Introducing Power Speech. |
| Jun/1993 |
Winbond Newsletter awarded "the 1993 Outstanding Employee's periodical of Taiwan. |
| Jun/1993 |
Captured silver medal in National Invention Awards. |
| Jun/1993 |
Received ISO9002 certification. |
| May/1993 |
Awarded by the Executive Yuan as the "1993 Outstanding Private Enterprise Providing Good Working Environment. |
| Apr/1993 |
Developed 0.6 micron high-speed SRAMs. |
| Mar/1993 |
Received IECQ quality certification. |
1992
| Date |
Milestones |
| Dec/1992 |
Power Speech intelligent speech synthesis IC earned Science Park Innovative Product Award. |
| Dec/1992 |
WINBUS 80486 DX / SX Chip Set received Science Park Innovative Product Award. |
| Sep/1992 |
Commenced operations at Fab II. |
| Sep/1992 |
Developed 0.8 micron high-speed SRAMs. |
| Jul/1992 |
HP PA- RISC cooperation. |
| Jun/1992 |
Winbond Newsletter awarded "the 1992 Outstanding Employee's periodical of Taiwan." |
| Jun/1992 |
Commended by R.O.C.. Labor Commission for outstanding performance in labor training. |
| Jun/1992 |
Introducing Winbus chipsets. |
| Feb/1992 |
Developed 1 micron 12 ns BiCMOS SRAM. |
1991
| Date |
Milestones |
| Dec/1991 |
Received Science Park R&D Investment Award. |
| Oct/1991 |
12ns BiCMOS 64K High-speed SRAM earned Outstanding Product Award from National Industry Association and Ministry of Economic Affairs (MOEA). |
| Sep/1991 |
Introducing Taiwan's first portable SCSI Card. |
| Jul/1991 |
Developed Taiwan's first 1.2 micron standard cell automated design system. |
| Jun/1991 |
Winning " 1991 Outstanding Enterprise Welfare Award." |
| Apr/1991 |
Developed Taiwan's first high-speed (110 MHz) RAMDAC IC. |
| Mar/1991 |
Co-developed one micron CMOS 386SX, 386DX and 486DX chipsets with Symphony. |
| Jan/1991 |
Joint development project on ISDN U-Transceiver with ERSO. |
| Jan/1991 |
Developed 12 ns BiCMOS 64K high-speed SRAM. |
1990
| Date |
Milestones |
| Mar/1990 |
Winbond Electronics North America established. |
| Mar/1990 |
Winbond Electronics (Hong Kong) established. |
1989
| Date |
Milestones |
| Dec/1989 |
LCD Dialer IC received Science Park Innovative Product Award. |
| Nov/1989 |
Introducing the first LCD dialer IC. |
| Oct/1989 |
Began construction of Fab II. |
| Aug/1989 |
Developed 1.2 micron 1M ROM. |
| Jun/1989 |
Introducing the first voice IC. |
| Mar/1989 |
Developed MGA Display Controller. |
1988
| Date |
Milestones |
| Oct/1988 |
Fab I produced first wafer. |
| Oct/1988 |
Commenced operations at Fab I. |
1987
| Date |
Milestones |
| Dec/1987 |
Developed first clock IC. |
| Nov/1987 |
Began construction of Fab I. |
|