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Winbond Announces Monthly Revenue for July
Aug/10/2009

(Taipei News) Winbond Electronics Corporation today announced its unconsolidated revenue for July 2009. Revenue for the month was NT$ 1.858 billion, an increase approximately 32.49 percent over June 2009. Accumulated revenues for January to July of 2009 totaled NT$9.19 billion.

On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., revenue in July 2009 was NT$ 2.575 billion, up approximately 22.04 percent over June 2009. Accumulated revenues for January to July of 2009 totaled NT$13.255 billion.
                

                                                   Winbond Electronics Corp. Monthly Business Revenue Report (Unit: NT$ 1,000)

            Revenue             Unconsolidatd (Note1)               Consolidated (Note2)
            2009 July            1,858,462             2,574,935
              2009 June            1,402,711             2,109,995
          Increase (Decrease)             32.49%              22.04%
             2009 Jan. ~ July             9,189,621             13,254,759
             2008 Jan. ~ July             14,524,716             15,637,618
         Increase (Decrease)              (36.73)%                (15.24)%

                    
                         Note1: The 2009 revenues are internal data and have not been audited by a CPA.
                         Note2: The consolidated revenues are internal data and have not been audited by a CPA. Consolidated members include   
                                     Winbond Electronics Corp. and its subsidiaries: Nuvoton Technology Corp. - research, development, design,
                                     manufacturing and sales of Logic IC, 150mm wafer fab production, testing and OEM; Winbond Electronics Corp.
                                     Japan – design, sales and service of semiconductor parts and components; Winbond Electronics Corp. America 
                                     - design, sales and service of semiconductor parts and components; Winbond Electronics (H.K.) Ltd. - sales and
                                     service of semiconductor parts and components; Nuvoton Technology Corp. America - design, sales and service
                                     of semiconductor parts and components; Nuvoton Technology (H.K.) Ltd. – post-delivery service of
                                     semiconductor parts and components.


Spokesperson
    Wilson Wen
    Executive Vice President of Memory IC Manufacturing Business Group 
    Tel:03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel:0966-233360
    Email:ckliu@winbond.com