(Taipei News) Winbond Electronics Corporation, a leading supplier of semiconductor solutions, announced that it will hold its 2002 Product Event today, at the Taipei Sherwood Hotel. The event will include presentations regarding the Company's new product development efforts, recent product launches and marketing strategy. It is designed to provide both press and customers with an interactive opportunity to learn more about the Company's current and future product plans.
Winbond will host presentations on seven key products. Highlights include:
1) The RSDS I/F TFT-LCD Source driver IC -- WR6615 for applications in Notebook & LCD Monitor module,
2) The lastest generation of IO chips "Smart@IO" - W83637HF for I/O application in floppy disk, printer, keyboard and mouse control as well as build-in Memory Stick function,
3) the digital camera chips --W99682+64KB EPROM W27C520+4bit uC W742C81A+8MB SDRAM, W99682+8bit uC W742C81A+8MB SDRAM for the application of 350K pixels & 1.3 Mega pixel digital camera,
4) The DECT chip -- W935Cxx for digital wireless communication in DECT phone.
5) The Mobile RAM Solution, a comprehensive solution for the RAM used in Mobile handheld device
6) The latest single channel voice Codec Chips for the application with inter-conversion bewteen analog-to-digital or digital-to-analog signals for telephony, telecommunication products and consuming products,
7) Introducing our first digital potentiometer, WMS7202. WinPot(Winbond Potentiometer), will be a new family of analog products utilizing embedded flash , and analog know-how for communication, digital consumer and industrial applications.
Winbond is currently Taiwan's largest branded IC Company and a major IDM company in Taiwan. The Company's business strategy is to focus on developing its suite of core technology to become a world class IDM provider and remain competitive in the global semiconductor for years to come. The Company focuses on developing long-term, high value core technology by stressing research and development. The Company's average annual R&D investment amounts to more than 10 percent of sales. This helps provide customers with reasonably priced and higher quality products. In addition to the Company's focus on R&D, Winbond continues to stress customer relationships and emphasizes building long-term, mutually beneficial partnerships.
Currently, Winbond's product lines include microcontrollers for consumer electronics products, PC and Peripheral ICs, Internet communication products, memory ICs and others. In Taiwan and the Eastern Asia territories, Winbond's PC I/O controller and voice ICs are market leaders. Winbond currently has three fabs in operation, and develops the industry's most advanced DRAM process technology, 0.13-micron and below. Currently the Company has approximately 4,000 employees worldwide with corporate offices located in Hsinchu, Taiwan. The Company also has subsidiaries in the U.S., Hong Kong, Mainland China, and Japan.
Information Contact: Joanne Liu
Sales Promotion Dept.
Winbond Electronics Corporation
Note: Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks mentioned herein are the property of their respective owners.