Winbond Electronics Corporation, the largest branded IC vendor in Taiwan, announced today that it would exhibit its PC Solutions at the Asia Pacific Intel Developer Forum, Fall 2002. The Forum will be held from Oct. 14th to 15th, 2002. Winbond's PC solutions will include:
Winbond SMART@IO® Solution
Winbond will showcase its SMART@IO® solutions. The chip supports Memory Stick, SD (Secured Digital), MMC (Multi-Media Card), Smart Card (PC/SC) and all legacy I/O features. SMART@IO® has been certified by Microsoft WHQL (Windows Hardware Quality Labs) and has been adopted by many PC and motherboard makers. In concert with its SMART@IO® chip solution, Winbond also provides an application program called SMART MANAGER which is designed to implement many convenient functions for Smart Card application. These include "Windows Smart Card Logon", "GSM SIM Card Phone Book Edit", "File Protection", etc.
Owning a smart card or memory card reader, no matter the interface -- PCMCIA, USB, or COM port -- is still an expensive endeavor when it comes to connecting to a personal computer. With the solution that Winbond provides, the cost of owning a smart card and memory card reader has been dramatically reduced. SMART@IO® has integrated the function and the interface into a single IC solution. Now there remains only the socket and cable to consider, but no controller IC. In addition, the reader module can be built to fit into a PC's 3.5" floppy disk, which can prevent the reader from being stolen. Winbond's IC Solution has successfully enabled several reader module makers to provide consumer with a very low cost reader module.
Winbond provides the best TCO (Total Cost of Ownership) for SMART@IO® solutions; a significant benefit for the PC end-user.
Winbond ACPI Controller Solution
Winbond will also exhibit its series of ACPI (Advanced Configuration Power Interface) control ICs. Just one year after launching this product, Winbond has gained significant market acceptance in the form of tier-one customer design-ins The product is in volume production, enabling the Company to move forward with its strategy of becoming a market leader of ACPI solutions.
Computer system architectures continue to become more complex with CPU and memory speeds increasing ever more rapidly with each technological turn. At the same time, new power management technology is being deployed in system designs to conserve power and reduce heat. This trend means that system timing and power control are becoming increasingly more critical to system performance. Therefore, an accurate and reliable power control system is essential. Many system designs use discrete components to implement the ACPI functions. Because of the variations inherent in system designs, R&D effort is required to address the power timing and sequencing. This approach creates several problems, including designs too complex for designers; inconsistent designs when different discrete components are used, more external components, board size consumption and difficulty in protecting the devices on-board when there is a power fault (e.g. over-current). In order to deal with these challenges, Winbond's series of ACPI solutions offer modular, accurate, reliable, flexible, cost-effective and easy-to-design solutions that address the ACPI specification. The chips' modular architecture provides an easy-to-design solution for designers and enables designers to save more design and revision time. Accurate and consistent properties are more compatible with power supplies; greater protection increases the reliability of the system. Fewer external components save board space and reduce BOM cost; and I2C interface provides more flexible options.
Base on Winbond's stable and mature processing technology for specific power ICs, Winbond can provide customers with faster delivery, higher performance solutions. In addition, in response to the dynamic demands of various market segments, Winbond provides a comprehensive series of ACPI solutions for PC applications. The W83301R/DR-O is aimed at the value market and the W83303D is aimed at the mainstream/performance PC market. Winbond's series of ACPI solutions addresses the ACPI specification and offers customers a flexible, reliable, cost-effective power management solution.
Winbond SDIO Host Controller Solution
Winbond's W86L488 is a SD/SDIO/MMC host interface controller used for PDA and handheld device to expand the SD/SDIO/MMC reader function. It provides SD/SDIO/MMC storage media read/write control and supports security commends for SD interface. The W86L488 supports two ports of memory card reader for data exchange between two cards. The W86L488 enables a more convenient and easy to use solution for data storage and data management. Winbond's SDIO turnkey solution provides the best quality product and greatest value for customers.
Winbond Hardware Monitor Solution
As part of addressing networking trends, Winbond will show its new generation SMART@I/O, the W83627NHF, the W83627HF and the integrated the hardware monitor IC, the W83791D. Through the W83627NHF, the network sever can easily monitor and control the environmental status of a client system. It provides a convenient solution for costumers in network management.
As the custodian of the PC, Winbond's H/W Monitor Series ICs monitors voltage, temperature and fan speed. Status of these functions can be showed in Windows 98/ME/2000/XP AP Hardware DoctorTM. The W83791D complies with the Alert Standard Format (ASF). In addition, the W83791D can serve as an ASF sensor and respond to an ASF LAN IC request to implement the network management functions in an OS-absent state. Through the W83791D, the network server is able to monitor the environmental status of the client system in an OS-absent state via Platform Event Trap (PET) frames returned from the W83791D. These parameters include temperatures, voltages, fan speeds, etc. Additionally, the W83791D supports SMBus 2.0 Address Resolution Protocol (ARP) commands. This eliminates address conflicts by dynamically assigning a new unique address to W83791D using the chip's Universal Device Identification (UDID).
Winbond IPMI Solution
Winbond will also demonstrate the W83910F, the Winbond IPMI (Intelligent Platform Management Interface) BMC. The IC has passed the ICTS (IPMI 1.0/1.5 Conformance Test Suite) test and offers a highly integrated controller solution that features LPC bus (with KCS, BT and SMIC physical protocols), hardware monitor, 5-sets master/slave I2C, RTC, GPI/O, remote control through modem and LAN, etc. Along with the W83910F, Winbond offers a complete software development kit (SDK) and firmware to assist customers in developing their IPMI server system. Winbond's IPMI total solution can reduce system development time and lower total cost of ownership (TCO) for entry through high-end level servers.
For more information:
Computer & Peripheral Product Marketing Division
Contact Person: Mr. Chad Wu
Note: SMART@IO® is a registered trademark of Winbond Electronics Corporation. All other trademarks mentioned herein are the property of their respective owners.