Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced that it has launched at new ISDN S/T controller. The W6691 integrates a S/T-transceiver and three HDLC controllers each with a flexible FIFO. The FIFO size of D channel is 64 bytes and the two B channels are 128bytes. The chip can operate in TE, LT-S and LT-T modes configured by an external pin. It can also be used for a NT2 application when the LT mode is selected. The IC features PCM bus or GCI bus to connect with a CODEC chip for voice applications. For other applications, theW6691 provides a B channel switching function between PCM, GCI and Layer-2. To address the needs of conventional embedded system applications, the chip operates using 3.3V. Two extended external interrupts are featured, saving additional circuit design real estate. Layer-1, the indication output, can be programmed via a microprocessor or using the W6691 chip's internal control. The DPLL circuit is built internally to generate the DCL and FSC signal for NT2 applications. This eliminates additional DPLL circuitry on board. TheW6691 also provides a 7.68MHz OSC signal for clock use in TE or NT2 applications.
The chip is suitable for NT2 (including PBX, NT-1+, etc.) and TE (including ISDN phone, backup line for ADSL-Router, etc.) applications. To simplify the design effort, Winbond also offers an evaluation kit which includes a board with voice application, software, sample code, datasheet and chip samples in 64 pin-LQFP packaging.
For more information:
Network Access Product Division
Contact Person: Mr. Yung Huan Hsu
Note: Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks mentioned herein are the property of their respective owners.