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Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced that it is launching a new generation I/O chip, the W83627THF. This new solution supports Intel's latest chipsets; the Springdale 865 and Canterwood 875.
The company's new LPC I/O chip provides both legacy I/O functions and several new features including over-voltage protection. The IC meets the industry's VRD 10.0 specification for Intel's Prescott CPU. The new features help to avoid the dangers associated with CPU burn out.
To improve the function of hardware monitors, the W83627THF also implements DC fan control and Smart FanTM. This helps to more easily control the fan speed. Total 3 set of fan speed control circuits can control the fans operate at either "Thermal CruiseTM" (constant temperature) or "speed cruise" (constant speed) modes. Thus it will extend the fan lifetime and reduce the noise.
Winbond's new I/O solution offers superior TCO (Total Cost of Ownership) and should prove highly valuable to PC end-users.
For more information:
Y.C. Lin
Computer Product Marketing & Planning Dept.
E-Mail: YCLin16@winbond.com.tw
Note: Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.
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