Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today launched the W83310S, a new DDR SDRAM bus termination regulator. The solution, new to Winbond's ACPI product family, is aimed at desktop PC and embedded system applications with DDR SDRAM requirements.
Computer systems architectures continue to evolve and are becoming more complex; CPU and memory speeds continue to increase ever more rapidly with every technology turn. More and more high current/low voltage power sources are required for PC systems. This is particularly true for high-speed components such as CPU, memory, and system chipsets. The performance of these components is highly dependent upon stable power. Therefore, motherboard designers require accurate, stable, low-ripple and robust power solutions for these components.
Many system designs use discrete components to implement bus termination functions. This approach creates several problems including poorer quality load regulation; higher voltage-ripple, increased usage of board space and inconsistent designs when different discrete components are used. In order to deal with these challenges, the W83310S has been designed to offer a single chip solution with accurate, cost-effective and easy-to-design properties for bus termination. The W83310S features a bi-directional regulator with driving and sinking capability; achieving 1.5Amp driving and sinking capability. In addition, the chip also offers integrated power MOSFETs, low external component count, low output voltage offset; + 5V, + 3.3V and + 2.5V operating power; a small footprint and SOP 8-pin packaging.
As part of Winbond's design philosophy, the Company's ACPI and PWM-series chips all provide total power management solutions for desktop PCs and motherboards by offering increased overall performance, flexibility, stability, and benefits
For more information, contact: Computer Product Marketing & Planning Dept. E-Mail: tcchang0@winbond.com.tw
For more information:
James T. C. Chang
Computer Product Marketing & Planning Dept.
E-Mail: tcchang0@winbond.com.tw