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Winbond releases Single Programmable Extended CODEC/SLIC IC for the VoIP Market
Oct/19/2006

San Jose, CA, Oct 1, 2006 — Winbond Electronics Corporation America, a leading supplier of semiconductor solutions to the consumer, computer, communications and electronics products markets, today introduced the latest offering in its Pro-X™ Series (PROgrammable EXtended CODEC/SLIC). The W681388 is a highly integrated solution to support one FXS telephone line interface. The device integrates SLIC (Subscriber Line Interface Circuit) functionality with a programmable CODEC as well as a DC-to-DC controller on a single piece of silicon.
"This introduction allows the benefits of our Pro-X™ Series to be used in systems which only require a single FXS port," said Saleel Awsare, Executive Vice President and General Manager, Mixed Signal Product Center. Such benefits include reduced power consumption, improved performance and the lowest Bill of Materials (BOM) cost in the industry.

The fully programmable CODEC supports a comprehensive set of signaling capabilities for telephone line supervision and control, offloading processor overhead and offering designers a user-friendly signal processing environment. The wide variety of clocking speeds and schemes facilitate easy system integration. An on-chip dual pulse width modulation (PWM) driver controls the DC-to-DC conversion for optimal power consumption. Programmable impedance and transhybrid balancing allow for worldwide deployment.

The W681388 is optimized for short loop applications and targets the VoIP equipment market space such as VoIP gateways, Analog Telephone Adapters (ATAs), voice enabled DSL and cable modems. Additionally, the device is also suited for Private Branch Exchange (PBX), Set top Boxes (STB) and FTTX applications.

The W681388 is available in 48-pin LQFP and 48-pin QFN RoHS packages. Samples are available now from local Winbond sales offices and its authorized representatives.

About Winbond

Winbond Electronics Corporation America, based in San Jose, California, is a wholly-owned subsidiary of Winbond Electronics Corporation, the largest branded IC Company in Taiwan and a leading supplier of semiconductor solutions worldwide. Winbond America designs, develops, markets and sells IC solutions to the global electronics marketplace. With a strong emphasis on mixed-signal solutions, Winbond America's primary mission is to serve the signal conditioning needs of computer, consumer and communications electronic manufacturers. Winbond Electronics Corporation has approximately 4,400 employees worldwide with design centers in Hsinchu, Taiwan; Shanghai, China; San Jose and Torrance, California; and Austin, Texas.

Note: Winbond is a registered trademarks of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

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Contact Person:

Velyn Sia

Marketing Operations Manager
Winbond Electronics Corporation America
TEL:408-474-1622
Email:info@winbond.com