Winbond Electronics Corp. recently introduced a new ISP (Image Signal Processor) chip designed to support 3 mega pixel CMOS sensor for high-end camera phones. The new device offers high-quality 3A functions (AE / AWB / AF) for mobile phones to deliver high-resolution camera in a timely manner.
Independently developed by an R&D team in Japan, the W99713K series achieved the best cost/performance ratio for the high-end mobile phone market. It supports most popular CMOS sensors to deliver colorful images with auto focus capability.
The W99173K comes in a tiny package, WLCSP (Wafer Level Chip Scale Package), to meet the stringent dimension requirement at CCM. By working closely with leading CCM (Compact Camera Module) makers, the W99713K is now ready for quantity delivery. Several pioneering design-wins already started their mass production in Japan & Taiwan.
Being a leader in the ISP field, Winbond will strive to roll out new products with more advanced features, like 5 mega pixel, anti-shake, etc., in the near future.
Contact us: Ryan Huang
Email: JAHuang@winbond.com
Tel: 886-3-5678168-8570