News

Kit Pairs Cypress's Robust WirelessUSB™ LP Radio System-on-Chip With the Winbond Single-Channel W681360 CODEC

SAN JOSE, Calif., Nov. 10, 2006 - Cypress Semiconductor Corp. (NYSE: CY) today introduced a demonstration kit for a Voice over Internet Protocol (VoIP) headset. The new CY4638 VoIP Demonstration Kit pairs the best-in-class interference immunity of Cypress's low-power WirelessUSB™ LP (CYRF6936) 2.4-GHz radio system-on-chip with the clean signal delivery of Winbond Electronics Corporation's W681360 CODEC to deliver in an easily replicated, fast time-to-market design. The robustness of the solution results in fewer interruptions than headsets using competing wireless technologies, with range over 20-meters.

The WirelessUSB™ LP headset board includes a Cypress Wireless enCoRe II flash microcontroller, a low power Winbond CODEC, and a rechargeable battery with the radio module. Winbond's W681360 single-channel voice CODEC is a 13-bit linear analog-to-digital and digital-to-analog converter. To provide the cleanest possible signal, the CODEC complies with the ITU-T G.712 recommendation for the analog-to-digital pre-filters (also known as anti-aliasing filters) and the digital-to-analog post filter (signal smoothing filter).

"A primary concern of VoIP headset manufacturers is dropping packets due to interference, making the extremely robust WirelessUSB™ LP solution a natural fit to deliver an uninterrupted flow of data," said Marcus Kramer, director of Cypress's Human Interface Division (HID) Business Unit. "Not only does the interference immunity of our WirelessUSB™ protocol outperform other 2.4-GHz solutions, its robustness outdoes more expensive DECT and Bluetooth solutions as well. When you add in the excellent signal quality of the Winbond Codec, the CY4638 VoIP Demonstration Kit provides the groundwork for a winning VoIP headset."

"Combining the W681360 CODEC with Cypress's WirelessUSB™ LP has proved to be a great match," said Frank Dowling, Product Marketing director at Winbond. "The low power consumption, excellent range, robustness and cost effectiveness our technologies bring to the CY4638 kit are a perfect fit for the VoIP headset market."

The CY4638 VoIP Headset Development Kit includes all of the following items:

• WirelessUSB™ LP Headset Board - Innovative dual antenna design for robustness. Uses Cypress WirelessUSB™ LP (CYRF6936), Wireless enCoRe II (CY7C60323) flash MCU and Winbond (W681360) 3V Single-Channel CODEC.
• WirelessUSB™ LP Bridge - Simple, small form-factor bridge. Uses WirelessUSB™ LP (CYRF6936) and enCoRe III (CY7C64215) USB flash MCU.
• WirelessUSB™ LP Demo Kit CD-ROM - Provides hardware schematics, bill of materials and firmware for Wireless VoIP headset design.

About WirelessUSB™ LP

Cypress's WirelessUSB™ LP offers an unparalleled feature set to enable superior interference immunity, low bill-of-materials (BOM) costs, higher data rate applications, and faster time-to-market for keyboards, mice, gaming devices, presenter tools, and remotes, as well as other simple, multi-point-to-point wireless applications. Featuring a highly integrated radio transceiver plus digital baseband on a single chip, it operates between 1.8 and 3.6 volts, using advanced power-saving techniques to extend battery life in devices such as wireless mice. WirelessUSB™ LP uses Cypress's patented frequency agile Direct Sequence Spread Spectrum (DSSS) technology to offer best-in-class interference immunity for a 2.4-GHz radio system. This combination of low power consumption, interference immunity and low cost make it ideal for wireless HID applications.

Availability

The WirelessUSB™ LP VoIP demonstration board is currently available and is priced at $249. For more information please refer to the Developer Kits link on www.cypress.com, or to purchase, click on the Online Store link or contact licensed Cypress distributors. A photo of the demonstration board is available at www.cypress.com/WirelessUSBLP-VoIP-headset-photo.

About Cypress

Cypress solutions perform: consumer, computation, data communications, automotive, industrial, and solar. Leveraging proprietary silicon processes, Cypress's product portfolio includes a broad selection of wired and wireless USB devices, CMOS image sensors, timing solutions, specialty memories, high-bandwidth synchronous and micropower memory products, optical solutions and reconfigurable mixed-signal arrays. Cypress trades on the NYSE under the ticker symbol CY. Visit us at www.cypress.com.

About Winbond

Winbond Electronics Corporation America, based in San Jose, California, is a wholly-owned subsidiary of Winbond Electronics Corporation, the largest branded IC Company in Taiwan and a leading supplier of semiconductor solutions worldwide. Winbond America designs, develops, markets and sells IC solutions to the global electronics marketplace. With a strong emphasis on mixed-signal solutions, Winbond America's primary mission is to serve the signal conditioning needs of computer, consumer and communications electronic manufacturers. Winbond Electronics Corporation has approximately 4,400 employees worldwide with design centers in Hsinchu, Taiwan; Shanghai, China; San Jose and Torrance, California; and Austin, Texas.

# # #

Cypress and the Cypress logo are registered trademarks and WirelessUSB™ and enCoRe are trademarks of Cypress Semiconductor Corporation. Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks are the property of their respective owners.

Contact