Winbond releases the WPC876x - family of Embedded Controllers with SPI ™ Flash Interface and MCE-compliant CIR port - WPC8769 and WPC8768
Winbond Electronics Corporation today announced its new generation highly-integrated Windows Vista ™ ready family of Embedded Controllers (EC) for mobile platforms, introducing SPI ™ Flash interface to EC and system BIOS, MCE-compliant Consumer Infrared (CIR) port and Fast Infrared (FIR) port.
Designed specifically for mobile platforms, the WPC876x feature typical keyboard & mouse controller functions such as internal keyboard matrix scan & decode. In addition, the WPC876x feature other value-adding functions:
- Shared BIOS flash option
- High-accuracy analog-to-digital (ADC) and digital-to-analog (DAC) converters
- Supports battery charging control
- Watchdog
- PWM modules
- Timers that support fan monitoring, system tick, etc.
- General-Purpose I/O (GPIOs)
- SMBus interfaces
- PS/2 interfaces
- UART
- System health management
- Supports Anti-shock systems
- Various analog controls
The WPC876x provide an unbeatable solution, where they and the BIOS flash occupy an extremely small space making them suitable for a very wide range of notebook form factors, including ultra-mobile PCs where board space is a critical consideration.
The WPC876x integrate a CIR module that supports remote-control capabilities, IR learning, IR emitting and System wake-up optimized for mobile PCs running Windows Vista ™ operating system. This eliminates the need for external CIR devices, thus providing a simplified and reduced-cost solution.
All WPC876x devices utilize a high-performance 16-bit RISC processor with a 4MB external address space for easy integration of concurrent functions - a necessity in today's competitive notebook market. The WPC876x can implement the traditional keyboard & mouse functions of a standard keyboard controller, with advanced power management and battery charging functions, in parallel with other functions.
Winbond also offers a complete set of utilities and software. This includes fully-featured Embedded Controller Firmware (EC FW) together with module-specific drivers (e.g., CIR driver).
Availability, Pricing
Two members of the new generation Embedded Controller family - the WPC8768 and WPC8769 - are available in a 128-pin LQFP package. For specific lead-time, pricing and additional information, please contact your local Winbond Electronics representative or distributor.
About Winbond
Winbond Electronics Corporation, a world-class leading supplier of IC product solutions, was founded in Hsinchu Science Park, Taiwan in 1987. The Company has excellent capacity in product design, research and development, manufacturing, marketing and sales services.
Winbond owns two business groups:
- Logic IC Business Group ------ focuses on two specific sectors including μ c-based consumer ICs and computer logic ICs.
- Memory IC Business Group -- is dedicated in Mobile RAM and Flash M emory. It covers major products in the field of low power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash Memory etc.
Winbond operates one 300mm wafer fab, two 200mm wafer fabs and one 150mm wafer fab. The company currently employs over 5,000 people and holds more than 2,500 patents worldwide. Winbond also has subsidiaries located in Mainland China, America, Japan and Israel.
More information about 2007 IIC-China, visit: http://www.china.iicexpo.com /
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All other product names that appear in this material are for identification purposes only and are acknowledged to be trademarks or registered trademarks of their respective companies.
Product Contact:
Vincent Chen, Deputy Director
Winbond Electronic Corp., Taipei, Taiwan
TEL: +886-2-81777168 ext:1437
Email: KHChen5@winbond.com
John Kenney, APC Marketing,
Winbond Electronics Corp. Japan
TEL: +81-45-478-1881
Email: jskenney@winbond.com
Dennis Lyden, Director of Sales
Winbond Electronics Corporation America. San Jose, California
TEL: +1-408-544-2632
Email: DLyden@winbond.com
Oren Tanami, APC Product Marketing,
Winbond Israel Ltd., Herzlia B, Israel
TEL: +972-9-9702260
Email: Oren.Tanami@winbond.com