Winbond will release a new series music chip, W567Cxxx series IC, with high sound quality solution for toy market and satisfied customer' high quality request. W567Cxxx series provides wider voice duration range that covered from 15" to 380" in single chip solution for wider application in toy market.
In addition, W567Cxxx series also playback at most 16-track of music output simultaneously to satisfy the toy market request of various sound effects and vivid feeling. Besides play16-channel high quality wave-table melody, it also can collocate the playback with melody and speech at the same time to get the mix sound result. Because of its' special structure, make its sound produced have extremely good sound quality and similitude. It also can do much kind of dynamically changes, such as, the tone changes, the pitch changes, the speed changes or volume changes. Moreover, it can get different sound effect such as vibrato, and modulator when using Winbond libraries, and can also playback from dual audio output to have the PAN stereo sound effect.
It also provides Serial Interface Management (SIM) and SPI interface to easy apply with Winbond serial Mask ROM and/or SPI Flash product to storage content of voice data and program in external memory. It is suitable for many kinds of cartridge applications or content expansion with lower BOM cost. Furthermore, W567Cxxx series build in 8-bit high resolution PWM mode output to drive LED in fading effect or drive motor in tiny control effect.
About Winbond Winbond Electronics Corporation, a world-class leading supplier of IC product solutions, was founded in Hsinchu Science Park, Taiwan in 1987. The Company has excellent capacity in product design, research and development, manufacturing, marketing and sales services.
Winbond owns two business groups:
- Logic IC Business Group ------ focuses on two specific sectors including μ c-based consumer ICs and computer logic ICs.
- Memory IC Business Group -- is dedicated in Mobile RAM and Flash M emory. It covers major products in the field of low power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash Memory etc.
Winbond operates one 300mm wafer fab, two 200mm wafer fabs and one 150mm wafer fab. The company currently employs over 5,000 people and holds more than 2,500 patents worldwide. Winbond also has subsidiaries located in Mainland China, America, Japan and Israel.
More information about 2007 IIC-China, visit: http://www.china.iicexpo.com /
Product Contact:
T.L. CHENG
Consumer Industry Marketing
TEL: +886-3-5678168 # 6291
E-mail: TLCHENG@winbond.com