Hsin Chu, Taiwan - March 2th, 2007 - Winbond Electronics Corporation announced today the release of its new W93562 DECT/WDCT digital wireless communication chip. The W93562 features hardware compatibility to Skype?and other peer-to-peer VoIP platforms utilizing its built-in USB 1.1 interface and complete USB driver for Internet telephony.
In recent years, internet telephony has swept the worldwide market as consumers and businesses embrace a greater world-wide community! Winbond's DECT/WDCT series of base-band chips offer many high integration solutions aimed at providing top-level design functionality.
Using Winbond's mature DECT/WDCT technology, the W93562 is the most competitive single chip solution for cordless IP phone applications. It can be integrated with Skype?software through USB interface as a cordless Skype?phone or can support flexible PCM I/F, and powerful API commands to connect with VoIP chipsets. Furthermore, the W93562 can offer both voice functionality and support conference calling among HS, PSTN and IM (Instant Messaging). W93562 supports all IM applications, including Skype? MSN Messenger? Google?Talk and Yahoo?Messenger etc. Clearly, this position, places Winbond's DECT/WDCT digital wireless communication chips as the best choice for developing the digital home communications of tomorrow.
Availability and Pricing
For specific information such as; lead-time, pricing and technical data, please contact your local Winbond sales representative or email to dect@winbond.com
About Winbond
Winbond Electronics Corporation, a world-class leading supplier of IC product solutions, was founded in Hsinchu Science Park, Taiwan in 1987. The Company has excellent capacity in product design, research and development, manufacturing, marketing and sales services.
Winbond owns two business groups:
- Logic IC Business Group ------ focuses on two specific sectors including μ c-based consumer ICs and computer logic ICs.
- Memory IC Business Group -- is dedicated in Mobile RAM and Flash M emory. It covers major products in the field of low power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash Memory etc.
Winbond operates one 300mm wafer fab, two 200mm wafer fabs and one 150mm wafer fab. The company currently employs over 5,000 people and holds more than 2,500 patents worldwide. Winbond also has subsidiaries located in Mainland China, America, Japan and Israel.
More information about 2007 IIC-China, visit: http://www.china.iicexpo.com /
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Product Contact:
Wendy
Network Access Product Marketing
TEL: +886-3-5770066 # 7499
E-mail: WPCHUANG@winbond.com