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American Megatrends introduces MegaRAC SP for Winbond WPCM450 Integrated Baseboard Management Controller
Apr/02/2008

ATLANTA, GEORGIA – American Megatrends (AMI), a leader in storage and computing innovations and Winbond Electronics Corporation, a leader in advanced logic and memory solutions, today announced AMI’s MegaRAC SP Service Processor Firmware Stack for the Winbond WPCM450 integrated BMC with KVM and virtual media capability.

The MegaRAC SP service processor firmware implements sophisticated remote management features for integrated Baseboard Management Controller (iBMC) System-on-Chip, including high-quality remote KVM redirection, virtual media, SMASH/CLP, WS-MAN support and IPMI 2.0 health monitoring and eventing. The firmware fully leverages the advanced features of the Winbond WPCM450 iBMC, such as
• Base-board management controller (BMC) fan management hardware
• Integrated  graphics engine for local and re-directed video/graphics
• KVM re-direction hardware including support for USB-based keyboard/mouse emulation
• USB 2.0 for Virtual Media
• Hardware encryption capability for data protection
• Serial ports for local terminals and Serial-over-LAN (SOL)
• Integrated SD Host controller for persistent memory applications
  
“AMI is proud to bring to market the SP Firmware stack for Winbond WPCM450, which widens our successful SP firmware product family. The combination of MegaRAC SP and Winbond WPCM450 provides OEMs with a formidable management subsystem on a chip that will accomplish many design wins for feature-rich server solutions,” said Justin Bagby, AMI’s Program Management Director. “MegaRAC SP leverages MegaRAC DS, a revolutionary development environment that simplifies integration on OEM platforms and development of enhanced management features for the datacenter, while contributing to reduce time-to-market and overall platform development costs.”

“We are very pleased to work with AMI to offer a comprehensive iBMC solution to the server market,” said Uri Trichter, Winbond’s Sr. Marketing Director. “With WPCM450 family of products and AMI firmware, customers will be able to design entry-level to high-end Servers with the right mix of IPMI manageability, graphics/video capability, I/O redirection, virtual media and innovative OEM-specific features. Preserving the same footprint, designers can incorporate Winbond’s iBMC on various platforms with common board design and software/firmware stack architectures, resulting in reduced time-to-market and product qualification efforts.”

The MegaRAC SP firmware stack can be easily ported to new platforms and enhanced or extended with MegaRAC DS, an Integrated Development Environment designed as a collection of Eclipse plug-ins utilized in development of all aspects of system management.
MegaRAC DS includes the following plug-ins:
• Visual Web Developer (VWD) for agile design of the web interface
• CIM SDK Plug-in for exposing platform management data in conformance with the Common Information Model (CIM) defined by the Distributed Management Task Force, the leading industry organization in the field of management technologies
• IPMI-PDK Plug-in, an invaluable tool for rapid layout of the platform sensors by easy drag-and-drop of information stored on a library
• SMASH Plug-in for design of the Command Line Interface and other SMASH profiles
• WS-MAN Plug-in for development of Web Services on the platform
Together, AMI MegaRAC SP firmware Stack and Winbond WPCM450 provide a compelling proposition for OEM developers interested in an advanced, rich management system-on-chip for servers and blades.

To learn more about AMI’s MegaRAC technology, please click HERE.

To learn more about Winbond’s iBMC technology, please click HERE.

About AMI
Founded in 1985 and known worldwide for AMIBIOS®, American Megatrends Inc. (AMI) supplies state-of-the-art hardware and software to industry-leading OEMs, system integrators and end users. AMI’s product lines includes StorTrends® IP IP-SAN and NAS storage appliances and management software, MegaRAC® remote management devices and software, long-life motherboards, backplanes and enclosure management controllers, and AMIBIOS® and Aptio® (UEFI) firmware and utilities. At its core, AMI is focused on R&D and engineering, with more than 85% of its staff dedicated to product development, QA, and technical support. Headquartered in Norcross, Georgia, AMI has a global presence, with locations in California, China, Germany, India, Japan, Korea and Taiwan to better serve its customers.

For more information on AMI, and its products and services, call 1-800-U-BUY-AMI or visit www.ami.com.

About Winbond
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including μC & μC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.

Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the company's operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.

Winbond operates one 150mm wafer fab and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan.

For more information, please visit: http://www.winbond.com

Note: Winbond is a registered trademark of Winbond Electronics Corp.. MegaRAC, AMIBIOS and StorTrends are registered trademarks of American Megatrends. All other trademarks mentioned herein are the property of their respective owners.


AMI Contact:
Umbertina Vezzani
Marketing Specialist
TEL: 770-326-8175
Email: umbertinav@ami.com

Winbond Contact:
News Contact:
Erin Chou
Sales Promotion Dept.
TEL: 886-3-5770066 #1086
Email: chchou7@winbond.com

Product Contact:
Kwai-Chuen So
Computer Logic IC Bus. Div.
TEL: 1-408-9436666 #1669
Email: KCso@winbond.com