News

San Jose, CA, August 13, 2007 — Winbond Electronics Corporation America today introduced a new highly integrated USB audio controller for the fastest growing area of the VoIP telephony market. The W681308 can be designed in all application segments of a Skype™ or other PC-based VoIP system and substantially speeds design time and time-to-market, increases system reliability and significantly lowers system cost.

The W681308 is the latest addition to Winbond’s growing family of USB Audio Controllers. With full function integration that quickens design time, the W681308 provides a single-chip, one-stop solution for a spectrum of Skype™ and other PC-based  VoIP applications from wired and wireless USB handsets, to USB speaker phones, to PSTN/USB dual mode phones, to USB PSTN gateways and USB Analog Telephone Adapters (ATAs) to the wireless  USB 2.4Ghz base / handset. Winbond’s new higher-integration part can replace 3 to 4 devices and offers the lowest BOM costs for PC-based VoIP applications. Its 16-bit ADC/DAC with 8/16/48-kHz wide-band sampling rate results in the best voice quality in a VoIP environment.

Winbond’s W681308 chip is USB2.0 full speed compatible and integrates a fast 8051 MCU that enables feature rich applications. The part also has a 8/16/48-kHz sampling rate wideband Codec with a 16-bit ADC/DAC and Acoustic Echo cancellation (AEC) and AGC to support USB speaker phone applications. This single-chip solution also supports full-duplex echo cancellation, 3-channel PCM mixer, integrated microphone amplifier and speaker driver, flexible OTP custom programming and complete reference design solutions. The high integration of the W681308 enables lower cost and smaller board space design.

Skype™, which has revitalized the VoIP market, experienced a significant growth since 2006 and with Skype’s US/Canada calling program at an annual US$29.95 cost, industry forecasts call for an exponential growth as compared to other VoIP telephony options. Winbond, a leading supplier of semiconductor solutions to the consumer, computer, communications and electronics products markets, continues its commitment to the VoIP market and specifically Skype™ phones and PC peripheral applications with these new products.

Winbond’s market commitment is to provide a complete line of USB Audio and PC-based VoIP solutions. With this new product for USB VoIP applications, we are enabling customers to easily and quickly build a full line of USB VoIP products for Skype™” said Ike Saeed, Vice President of Marketing Mixed Signal Product Center, Winbond Electronics Corporation America.

This device joins the Winbond USB Audio Controller Series (W681306, W681307 and  W681308) which provides a complete line of USB VoIP and audio solutions including Skype™ with integrated, fast MCUs, USB2.0 Full Speed compliant controller, 16-bit ADC/DAC with 8-kHz to 48-kHz sampling rate. They support Skype™ or SIP USB VoIP application and other (Instant Messaging (IM) options such as MSN and Yahoo Messenger. This Series is  designed to provide the highest voice quality in a VoIP environment and delivers USB VoIP solutions for customers with the shortest time-to-market requirements.

A complete Software Development Kit (SDK) and 8051-based Keil C development system for these parts is available. The W681308 is in a 48-pin LQFP lead-free package. W681306 and W681307 are both in 100-pin LQFP lead-free packages. W681308 pricing is being quoted as $1.80 at 10k quantity.  Additional product information for USB Audio Controllers is available at http://www.winbond.com/hq/enu/ProductAndSales/ProductLines/mCAndmC-basedConsumerIC/Telecom/USBAudioController/.

About Winbond

Winbond Electronics Corporation, a leading provider of IC-based solutions was founded in Hsinchu Science Park, Taiwan in 1987. The company has first-rate capabilities in product design, research and development, manufacturing, marketing and sales. Winbond's two business groups each focus on specific sectors:

• Logic IC handles µc-based consumer ICs and computer logic ICs.
• Memory IC is dedicated to Mobile RAM and Flash memory. Its major products include low-power DRAM, specialty DRAM, Pseudo SRAM, commodity DRAM, and low-density Flash.

Winbond* operates one 300 mm wafer fab, two 200 mm wafer fabs** and one 150 mm wafer fab. The company currently has over 5,000 employees, and holds more than 2,500 patents worldwide. Winbond also has subsidiaries in Mainland China, the United States, Japan and Israel. For more information, visit: http://www.winbond.com

Note：
*Winbond is a registered trademark of Winbond Electronics Corporation.  All other trademarks and copyrights mentioned herein are the property of their respective owners.
**Winbond officially announced the sell of 200mm fabs to Vanguard International Semiconductor Corporation (VIS) on March 22nd, 2007. The property transfer time is scheduled to be on January 1st, 2008.

News Contact:
Erin Chou
Sales Promotion Dept.
TEL: +886-3-5678168#8686
Email: chchou7@winbond.com