For years, Winbond has been a major supplier of the key IC components for the PC motherboards, notebook PCs, industrial/embedded PCs and servers markets. The company is proud to provide customers with a total solution for the latest PC platforms with our cost effective broad portfolio of products.
The W83116WG series solution is the latest Clock Generator devices from Winbond which support the latest Intel® Bearlake/Eaglelake series platform. In addition to multiple output clocks for the systems, the W83116WG series solution is compliant to Intel® CK505 Specification. The new I/O structure, together with the integrated voltage regulator and resistor, enhances noise resistance and reduces power consumption. The W83116WG series solution features the dynamic over-clocking function to provide more flexible application in over-clocking. Moreover, it also supports Spread Spectrum technology which is effective in reducing EMI.
The Winbond timing solution for Intel platforms improves system stability and overall functionalities and also lowers customer's production costs. The device has been positively reviewed by our customers and has been successfully designed into their next generation products.
Winbond is a major supplier of Clock Generators for the most popular processor/chipset platforms in the market for the computer manufacturers. Winbond will continue to invest in the research and development of timing solutions with the latest industry sought-after features and cost effectiveness.
About Winbond
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including μC & μC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.
Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the company’s operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.
Winbond has over 5,000 employees worldwide and operates one 150mm wafer fab, two 200mm wafer fabs (*), and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan. For more information, please visit: http://www.winbond.com
*Note: Winbond officially announced the sale of 200mm fabs to Vanguard International Semiconductor Corp. (VIS) on March 22 nd, 2007. The property transfer is scheduled for January 1 st, 2008.
Product Contact：
Chad Wu
Computer Product Marketing Division
TEL ： 886-3-5770066-7012
Email ： MCWU0@winbond.com
News Contact：
Erin Chou
Sales Promotion Dept.
TEL：886-3-5770066-1086
Email：chchou7@winbond.com