With the approach of the 3D multimedia era as well as the rise in popularity of Internet enabled gaming consoles, games tapping unlimited imagination and eye-popping graphics are now a possibility. The traditional toy industry and low-cost TV game systems can now afford to march into the 3D digital multimedia domain with a high-tech console gaming framework.
This entertainment trend has taken the tweens (*1) generation by storm. In order to satisfy the pursuit of new hi-tech trends for KGOY (Kids Getting Older Younger), Winbond is introducing an IC chip for multimedia and interactive toys: W55VA75. This chip provides digital multimedia playback functions, as well as integrating a gaming console for 3D animation effects, while also supporting a 2 mega pixels digital camera with M-JPEG digital recording and playback functions. This Winbond chip is the perfect solution for next-generation digital multimedia toys that will bring cost benefits for both the developer and consumer. This trend in entertainment toys is projected to bring NTD$1~1.5 billion to the IC market annually.
The W55VA75 chip uses a 32-bit CPU core product design. The chip is capable of supporting playback of video formats in addition to playback of audio formats. High performance and low power consumption for digital multimedia solutions are met through production using an advanced semiconductor process. The built-in 3D-Like Graphics Engine brings high resolution gaming graphics to life, and will support VGA quality televisions and LCD displays. The Winbond chip is perfect for interactive gaming consoles for both educational and entertainment purposes. Digital image processing capabilities are also integrated into the chip and it will support a 2 mega pixels digital camera for digital recording and playback functions. This chip is the perfect solution for new toys in this digital multimedia era.
With rapidly changing next-generation gaming console products, the traditional toy market is currently facing an ever-changing challenge. Winbond has successfully developed the W55VA75 to provide a highly flexible open-platform, which will support development of many algorithms for all types of interactive toys. This chip provides a complete set of software and hardware development tools, simulators(*2), ICE(*3), and Operating System for the programmer. This will greatly reduce development timeframes and push completed products onto the market on time.
About Winbond
Winbond Electronics Corporation, a world-class leading supplier of IC product solutions, was founded in Hsinchu Science Park, Taiwan in 1987. The Company has excellent capacity in product design, research and development, manufacturing, marketing and sales services.
Winbond owns two business groups:
Logic IC Business Group ------ focuses on two specific sectors including μc-based consumer ICs and computer logic ICs.
Memory IC Business Group -- is dedicated in Mobile RAM and Flash Memory. It covers major products in the field of low power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash Memory etc.
Winbond operates one 300mm wafer fab, two 200mm wafer fabs and one 150mm wafer fab. The company currently employs over 5,000 people and holds more than 2,500 patents worldwide. Winbond also has subsidiaries located in Mainland China, America, Japan and Israel.
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*1: A Tween is someone between the age 8 and 12.
*2: Simulator is a type of computer software simulator that is able to operate on different computer configurations by simulating the hardware.
*3: ICE (ICE: In-Circuit Emulator) is a chip that can emulate a CPU or microcontroller, providing an even more proficient debugging environment and method by integrating the hardware and software into a single package. Generally speaking, issues between hardware and software are inevitable during the development process, and the ICE enables software designers to run their code through the prototype hardware at an early stage of the development process. At the same time, the hardware designers will understand how the system code will run on their prototype hardware and accordingly will be able to perform hardware debugging.
Product Contact:
Erik Lin
Consumer Industry Marketing
TEL: +886-3-5678168 # 6285
E-mail: CPLin@winbond.com
News Contact
Ivory He
Sales Promotion
TEL: 886-3-5678168-8683
Email: HYHe0@winbond.com