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High Performance Serial NAND Flash

The new W25N / W72N is a single-level cell (SLC) serial NAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC).

Winbond new High Performance Serial NAND enables a data transfer rate four times faster than Parallel NAND and other Serial NAND currently on the market.

Transferring data at 83MB/s, which far exceeds competing NAND flash on the market, Winbond's new solution accelerates instrument cluster boot-up time.

 

 

 

It also supports dual-quad I/O interface to accommodate higher storage density or data transfer rate up to 166 MB/s. The selection allowing for single, dual and quad I/O means customers can enjoy more flexibility compared to what competitors can offer.

Furthermore, Winbond this new High Performance Serial NAND supports hardware reset pin which is more convenient for hardware / software design for automotive applications.

Density

Part No. Voltage Speed Temp. Features Status Automotive Datasheet
W25N02JW 1.7V-1.95V STR166Mhz / DTR83Mhz -40℃ ~ 85℃ / -40℃ ~ 105℃ SPI / QPI / DTR , On-Chip ECC P UD
W72N02JW 1.7V-1.95V STR166Mhz / DTR83Mhz -40℃ ~ 85℃ / -40℃ ~ 105℃ SPI / QPI / DTR / Dual Quad , On-Chip ECC P UD
Status1 :P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design, EOL=End of life.
Status2 :All winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection

Solution

Technical Documentation

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