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串口式 (SPI) NAND 型闪存

Code Storage Serial NAND Memory

Winbond, the worldwide leader in Serial NOR Flash memories, is offering a new family of Serial NAND Flash memory with an SPI interface. These products are an extension of the Serial NOR Flash products at higher densities. To simplify the life of designers looking to store code on their systems at densities beyond the NOR Flash offering of 512Mb density, Winbond is offering Serial NAND products with the same SPI interface with a cost effective NAND based solution at higher densities like 1Gb and 2Gb.

Benefits of using Winbond Serial NAND

While NOR flash is more cost effective at lower densities, NAND Flash is a more cost effective memory at densities in the 1Gb and above range.

NAND Flash memory requires a controller to manage the functionality of NAND such as detecting errors in some locations of memory and correcting these errors, managing blocks of memory that have errors in them, and being able to relocate or map the locations with errors to new locations that are error-free.

The Serial NAND family of products are designed to take some of the burden of the controller off its shoulders. These products have built-in ECC (Error Correcting Code that detects and corrects errors) and offer contiguous good memory (bad block management), and hence off loads these functions from the controller.

The added advantage from the Winbond Serial NAND is that it offers continuous read functionality. Typically in most systems, code stored in non-volatile memory, like flash, is transferred to DRAM for faster execution of code with the processor. This is known as code shadowing. System designers are always looking for products that can transfer the code very quickly from flash to DRAM. Winbond Serial NAND offers a continuous read mode that transfers the contents of NAND very quickly to the DRAM.

Key Features of the Serial NAND Family

  • 46nm SLC NAND technology in Winbond’s 12” Fab
  • First offering is 1Gb, with 2Gb on roadmap
  • 3V power supply
  • Continuous 52MB/s Read Data Throughput ideal for Code-Shadowing applications
  • Fully backward-compatible SpiFlash Instruction Set with minor additions
  • Low pin-count SpiFlash packages (WSON-8, TFBGA-24) with MCP options
  • On Chip 1-Bit ECC correction and Bad Block Management
  • Flexible device configurations by customers’ need (Buffer/Continuous Read, Array/Device Lock-Down/OTP/write protection)
  • Industrial grades

2Gb

Part No. Voltage Speed Temp. Organization Status Automotive Purchase
W25M02GV 2.7 - 3.6V 104MHz (208/416MHz Dual/Quad-SPI) -40℃~85℃ 2048+64Byte page size 128K+4KByte block size Dual/Quad-SPI P UD
W25M02GW 1.70 - 1.95V 104MHz (208/416MHz Dual/Quad-SPI) -40℃~85℃ 2048+64Byte page size 128K+4KByte block size Dual/Quad-SPI P UD

Status1:P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design, EOL=End of life.

Status2:All winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

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