New ASIL-D certificate boost safety and security credentials of Winbond’s W75F Secure Memory Element

CC EAL5+ certified W75F memory provides comprehensive protection for code and data

New ASIL-D certification helps automotive manufacturers design systems for compliance with ISO26262 functional safety standard

TAICHUNG, Taiwan – November 11, 2020 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its W75F, the industry’s first Secure Flash memory device with Common Criteria EAL5+ certificate, has now achieved the ISO26262 ASIL Grade D safety certification.

For automotive market, the W75F Secure Memory is compliant with the AEC-Q100 and is now officially certified ASIL-D. The W75F device provides fault detection capabilities covering more than 99.9% of failures ranging from flash array cells, through the physical interface, and all the way to the host. The safety rating for the W75F surpasses that of internal embedded Flash memories while offering much more storage capacity that can potentially be scaled up to even higher densities. .

Winbond said: ‘The W75F is the ideal external secure memory companion, offering high level of security assurance at Common Criteria EAL5+. Now with the addition of ASIL Grade D certification, the W75F is even more beneficial for automotive platforms, which have to meet stringent requirements for security and functional safety. Winbond is the only flash vendor with the proven capability of designing devices that can bridge the gap between high safety and high security levels without compromising either.’

The W75F has also been certified with the Security Evaluation Scheme for IoT Platforms (SESIP) scheme for IoT and smart connected devices up to Level 3 with physical attacker.

The W75F Secure Memory is the industry’s proven secure external Flash device for code and data storage. It offers a dependable solution for manufacturers of connected systems, which want to defend their products against threats such as replay, rollback, man-in-the-middle, sniffing, side-channel and fault injection attacks.

It is available in densities of 4Mb, 16Mb and 32Mb and is available in industry-standard SOP16, QFN32, and WLCSP packages.

Key features of the W75F include:

• Secure eXecute-in-Place (XiP)
• Tamper-resistant
• Code and data confidentiality and integrity
• Mutual authentication with SoC
• Shared memory architecture for multiple domains
• 21MB/s secured and authenticated throughput
• 100,000 program/erase cycles
• 20-year data retention

Winbond’s W75F Secure Memory Element is in mass production. More information can be found at www.winbond.com.