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Winbond Announces Corporate Reorganization Winbond Announces Corporate Reorganization

(Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows:

Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM wafer fab, has been assigned to manage the Company's future Tainan Science-based Industrial Park 12-inch wafer fab. His responsibilities include overseeing engineering, manufacturing facilities and production automation. The former Technical Executive of Winbond's DRAM Business Group, Zhe-Rong Hsu, has been appointed as the new Assistant Vice President of the Company's 8-inch DRAM wafer manufacturing center. 

Ą°The Company is establishing a new quality environmental health and safety center. The former Assistant Vice President of the Quality & Reliability Assurance Division, Rueyway Lin, has been appointed to manage the new center; Quality & SHE (Quality and Reliability Assurance and Safety and Health and Environment Center).

Ą°The former Assistant Vice President of the Company's Administration Center, Michael Ming-Huang Liao, will turn over his post with honor in June, 2000. The Assistant Vice President of Facility Service Center, Hander Chang, has been appointed as the new Assistant Vice President of the Administration Service Center and will also continue to serve as Winbond's public relationship spokesperson.

Ą° In order to more effectively address evolving business needs in an increasingly global business arena, Winbond has established a new enterprise knowledge management center, "Knowledge Management Center". Doctor George Kuan-Ho Tsao, has been promoted to Assistant Vice President of the center. Doctor Tsao who is the former Director of Computer Integrated Manufacturing Division and he reports directly to the President. 

Ą°To strengthen the Company's global sales network, improve competitiveness and enhance the company's e-commerce service, Winbond will set up its Sales Division V, and Sales Operation /Promotion Division, under Winbond's Sales Center.

The former Assistant Vice President of 8-inch DRAM wafer manufacturing center, James Fang, has been appointed manager of wafer manufacturing facility center and the project manager of the Company's future 12-inch wafer fab. James Fang has been with Winbond for more than 12 years. He was previously the Director of Winbond's first wafer fab and was instrumental in successfully establishing the Company's wafer Fab 4 and Fab 5. He also was responsible for managing the Company's DRAM strategic alliance with Toshiba Corporation and recently successfully completed that project's DRAM technology transfer and scale-up production plan. He is a graduate of the Physics Department of National Tsing Hua University. Looking forward, Fang will leverage his experience and expertise as he takes on the major responsibility of establishing the Company's new 12-inch wafer fab and production automation. 

The former Technical Executive of DRAM Business Group, Zhe-Rong Hsu, has been appointed the new Assistant Vice President of the Company's 8-inch DRAM wafer manufacturing center. Hsu joined Winbond more than 12 years ago and has been instrumental in successfully overseeing the construction of Fab 1 and Fab 2. He also participated in key production and technology projects crucial to product development and production capacity planning. He was formally the Director of Fab 2 and he received his master degree from National Tsing Hua University. Hsu's new assignments will include overseeing the Company's 0.13-micron trench DRAM technology development and transfer alliance with Toshiba Corporation and Fujitsu of Japan. 

The former Assistant Vice President of the Facility Service Center, Hander Chang, is the Company's new Assistant Vice President of Administration Service Center. He will oversee the company's talents recruitment and training programs and various major purchasing efforts associated with the Company's future 12-inch wafer fab. He will also serve as Winbond's public relationship spokesperson.

Winbond's strategic plans strongly emphasize environmental, health and production safety. The Company views these issues as crucial to the continuing success of its global quality initiatives. To more effectively leverage all of these efforts, the Company has established a new Quality & SHE (Quality and Reliability Assurance and Safety and Health and Environment Center). Doctor Rueyway Lin has been named Assistant Vice President of the Center. The Center's mission is to ensure that the Company continues to operate a healthy, safe working environment and to ensure Winbond's compliance with various environmental regulations.

The Company's newly established " Knowledge Management Center" will be headed by the Company's former Director of Computer Integrated Manufacturing Division, George Tsao. Doctor Tsao graduated from the Electronic Engineering Department of the National Chiao-Tong University and received his Ph.D. in materials science and electric engineering from Stanford University, United States of America. He is named as the first recipient of an EMBA from the National National Chiao Tung university. Doctor Tsao has more 14 years technical and management experiences in semiconductor industry and has worked as engineer and researcher at Intel Corporation and Philips Semiconductor Corporation. Doctor Tsao joined Winbond more than 7 years ago as the Company's Deputy Director of Computer Integrated Manufacturing Division. Doctor Tsao's strong background in semiconductor components, R&D, production, design and experience with multinational high technology companies form the foundation of his expertise in successfully managing the Company's new Knowledge Management Center.

Winbond has made great strides in its overseas market development and global sales efforts and now has customers in Taiwan, USA, Hong Kong, PRC, Europe and throughout Southeast Asia. Since last year, the Company's sales business efforts in northeast Asia have proven particularly successful. To enhance Winbond's worldwide sales network, the Company has established its 5 Sales Divisions based on geographical regions with the goal of further improving service to customers and more effectively utilizing application and sales resources to develop products for emerging markets. The Company has also established a new Sales Operation /Promotion Division to actively promote Winbond's E-commerce service and to further improve sales and service efficiency to customers worldwide.

Through this new corporate structure, the Company's goals are to enhance the effectiveness of its business management teams, meet rapidly evolving needs of the new economic era and successfully expand Winbond's international business operations. Winbond is actively facing the challenge of continuously improving its business efficiencies. Moreover, the Company has laid a firm foundation for sustained growth as it readies the corporation for increased competition at the dawn of the global E-era in business. 





Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel:03-5792755
  
News Liaison
    Mike Liu
    Deputy Director
    Tel:03-5792516
    Email:ckliu@winbond.com

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