(Taipei News) Winbond Electronics Corporation announced that the project for building a fabrication plant of 12" has obtained approval from the board meeting on April 30. According to the project, the construction of said plant will break ground at the 3rd quarter of 2004 at Taichun Science-based Industrial Park. Following the completion of overall structure, subsequent installment of clean rooms and equipments will ensue in the early 2005. By the 4th quarter of 2005, it will move on to the pilot-run phase. The estimated manufacturing capacity is 24,000 pieces of wafers per month and with the flexibility to upgrade to 48,000 pieces per month in the first stage. The 0.11-micron process technology will be employed to manufacture memory products.
Investment of this new plant requires the funding of 49 billion NT dollars, which may come from internal funding as well as loans in the first stage. This new plant will play a crucial role to enhance the long-term competitive advantage of Winbond Electronics Corp.
Spokesperson
Wilson Wen
Vice President of Administrative Center
Tel：03-5792755
News Liaison
Mike Liu
Deputy Director
Tel：03-5792516
Email：ckliu@winbond.com