(Taipei News) Winbond today announced that the board directors have passed an important resolution on management changed for enhancing the executive management expertise. Mr. Yuan-Mou Su, Assistant Vice President of DRAM/SRAM Product Center, is promoted to Vice President of Memory IC Business Group. Mr. Chi-Kuo Wang Vice President of Memory IC Business Group, is transferred to the Chairman's Office to serve as the Executive Assistant to the Chairman/ Chief Strategic Planning Executive. Mr. Chen-Hsi Lin is promoted from Assistant Vice President to Vice President, and acts as the head of Technology R&D Group. Mr. Jui-Wei (Ray) Lin is promoted from Assistant Vice President to Vice President, and acts as the head of Quality & SHE Center.
Mr. Yuan-Mou Su holds a Masters degree in Electrical Engineering from the University of Southern California. Before joining Winbond, Mr. Su had served at Advanced Micro Devices Inc. (AMD), Digital Equipment Corp., Integrated Devices Technology. After working with Winbond, he has experienced sequentially as Vice President of Winbond Electronics Corp. America, Director of DRAM / SRAM IC Business Division, and Assistant Vice President of DRAM/SRAM Product Center. Mr. Su owns over 20 years experience as well as many patents in the memory product and technology development fields. In the future, the R&D teams will be constantly moved forward with the leadership of Mr. Su.
Mr. Chen-Hsi Lin holds a Ph.D. degree in Applied Physics from Harvard University. Prior to joining Winbond, he had served as Deputy Divisional Director of Corporate Marketing and Technology Development at UMC, senior member of Logic Technology Division at AMD, Technology Manager of IC Business Division at Hewlett-Packard, and member of Technical Staff of EE Department at MIT in the USA. He has worked with Winbond since 1995, and served as Director of ASIC Technology Division, Deputy Director of Process Technology Division and Assistant Vice President of Emerging Technology Center. He has more than 20 years of experience in the technology development field.
Mr. Jui-Wei Lin received a Ph.D degree in Material Science and Engineering from Cornell University. Prior to joining Winbond, he served as a Researcher at the Industrial Technology Research Institute (ITRI),a Lecturer in National Taiwan University, an Engineer at IBM, and a Research Associate in Cornell University. He has served sequentially as Director in Quality Assurance Division, and Assistant Vice President of Quality & SHE Center. After working with Winbond. Mr. Jui-Wei has over 20 years of experiences in the product quality control field. He will be tasked to leverage the quality management performances.
The resolution for this top management promotion will enhance Winbond's operation capability after its successful transformation. The Company is continuing to move forward by developing its leadership and management expertise enabling the Company to move forward and demonstrate better operational performance.
Spokesperson
Wilson Wen
Vice President of Administrative Center
Tel：03-5792755
News Liaison
Mike Liu
Deputy Director
Tel：03-5792516
Email：ckliu@winbond.com