(Taipei News) Winbond Comments on the Announcement that Qimonda AG has filed a petition in Germany for its financial restructuring program as below.
As of today, the unpaid accounts receivable for DRAM wafers shipped to Qimonda are about NTD 950 million. In regard to the 16,000 wafers shipped to Qimonda per month, Winbond will adopt a strategy of direct selling to deal with the contingency
As the 65nm technology has entered the mass production stage and will sufficiently meet demands of Winbond’s niche DRAM products over the next few years, there is no doubt about Winbond’s future competitiveness.
In order to reposition the company back onto a solid base, Germany insolvency law offers creditors a period of protection. Qimonda would be able to continue its business under the monitor and guidance of the German state. Winbond will keep track of related information in the oncoming week and announce further information after Chinese New Year holidays.
Spokesperson
Wilson Wen
Vice President of Administrative Center
Tel：03-5792755
News Liaison
Mike Liu
Deputy Director
Tel：0966-233360
Email：ckliu@winbond.com