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Winbond Injected USD Fifteen Million into Winbond Int'l Corporation

(Taipei News) November 29th, 2006 Winbond today announced that the Board of Directors has approved a capital injection of USD 15 million into Winbond Int'l Corporation (WIC). The purpose of the capital injection is to finance the general working capital of Winbond Electronics Corporation America (WECA). 

Based in San Jose, California, WECA is responsible for design, development, marketing and sales of IC products in Europe and the US. It provides effective and timely support to customers in the territories. WIC wholly owns the stocks of WECA and entrust WECA to research and develop IC products. 



 
Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel:03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel:03-5792516
    Email:ckliu@winbond.com

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