(Taipei News) Winbond Electronics Corporation today announced the results of its Board of Directors meeting held on February 2, 2007. The Board approved audited financial statements for the fourth quarter of 2006. Net sales totaled NT $11.16 billion. Net income after tax was NT$1.727 billion; net income per share was NT$0.45. The accumulated revenue from January to December of 2006 totaled approximately NT$ 34.488 billion, an increase of approximately 24 percent when compared with NT $27.815 billion over the same period last year. Net income after tax was NT$ 2.364 billion; net income per share was NT$0.62.
Thanks to the prospering consumer products market and increasing DRAM demand, the semiconductor industry continuously grew over last year. In addition to strategically integrating market demands, Winbond committed to consolidating resources and grasping superior products to increase its revenue. The Company also showed a significant progress in the fields of cost control, product development, and technology innovation.
In terms of memory products, both the volume and the yield of 300mm wafer fab reached the target in the fourth quarter last year; 90nm migration was also on schedule. Specialty DRAM continuously transferred to 0.11Łgm technology, improved production efficiency, and cost reduction in packaging and testing together resulted in further margin expansion. Commodity DRAM was benefited from good pricing and growing shipment. Therefore, memory products created a better result in the fourth quarter.
As for logic products, with the strong shipments, speech IC in consumer logic business outperformed the expectation in a traditional slow season in the fourth quarter. However, computer logic business was hurt by price competition in notebook market. Motherboard related I/O demand was also declined because of the CPU shortage. The total revenue of logic products decreased as compared to the third quarter.
Looking forward to 2007, revenue in the first quarter will slightly lower due to DRAM price pressure and a slow season for logic products. Winbond will continue to strengthen its competition advantage and incorporate flexibility in its product mix to meet market demands. As semiconductor industry is expected to grow, as a whole, Winbond maintains a cautiously optimistic attitude towards 2007. Speech ICs
Spokesperson
Wilson Wen
Vice President of Administrative Center
Tel：03-5792755
News Liaison
Mike Liu
Deputy Director
Tel：03-5792516
Email：ckliu@winbond.com