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Winbond Announces Monthly Revenue for June

(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of June, 2009. Revenue for the month was NT$ 1.403 billion, an increase approximately 2.49 percent when compared with NT$ 1.369 billion in the previous month. Accumulated revenue for January to June of 2009 was NT$ 7.331 billion.

Currently Winbond’s 300mm wafer fab is running at near full capacity. In June, Specialty DRAM business enjoyed a positive growth attributable to the completion of migrating to 300mm wafer fab and the expansion in Hard Disk, LCD TV and Set Top Box markets, although shipments in the Mobile RAM segment showed slight decline caused by inventory adjustments from customers. As the Company continued striving to expand NOR Flash market, sales revenue increased steadily. Revenue from Memory Product Foundry Service also performed a month-on-month growth thanks to stable yield of the 300mm wafer fab.

Winbond, the leading supplier of Specialty DRAM and NOR Flash memory, continues moving forward with its maximum competitiveness. Now the Company’s Specialty DRAM and Mobile RAM have completed the transition to 300mm wafer fab production, leveraging technology and service to be on par with first-tier manufacturers in the industry. NOR Flash using 300mm wafer fab based on 90nm technology process also entered into mass production stage which could contribute to the Company’s business in the long run.

                      
                                                     Winbond Electronics Corp. Monthly Business Revenue Report (Unit: NT$ 1,000)

Monthly Revenue
Accumulated Revenue
   2009 June 1,402,711  2009 Jan. ~ Jun.

7,331,159

   2009 May 1,368,576  2008 Jan. ~ Jun. Note 2 12,984,166
Increase (Decrease) 2.49% Increase (Decrease) (43.54)%


      Note 1: The 2009 revenue is internal data and has not been audited by a CPA.

Note2: Revenue in the first half of 2008 still includes the Logic IC Business.



Spokesperson
    Wilson Wen
    Executive Vice President of Memory IC Manufacturing Business Group 
    Tel:03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel:0966-233360
    Email:ckliu@winbond.com

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