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Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 Americas

Date : 2014/4/8-2014/4/11
Location : Dallas, Texas at the Gaylord Texan Resort& Convention Center
Booth : Space Plus

Winbond Electronics Corporation America will participate in the Freescale Technology Forum (FTF) 2014 Americas as a Silver Sponsor.

Come visit Winbond in the Technology Lab April 8 to 10, 2014 to learn more about our memory solutions for internet of Things (IoT).
More information at www.freescale.com/FTF

About Winbond

Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC’s. The company provides memory solution backed by the expert capabilities of design, manufacturing and sales services.

Winbond’s product portfolio, consisting of Mobile DRAM, Specialty DRAM and Code Storage Flash, is widely used by tier-1 customers in consumer, communication, computer peripheral and automotive markets. Our 300 mm wafer fab keeps pace with advanced process technologies to provide high-quality memory IC products.

The Company was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarter in Central Taiwan Science Park, Taichung, Taiwan . Winbond also has subsidiaries in China, Hong Kong, Israel, Japan and the US. For more information, please visit: www.winbond.com. 

*Note: Winbond is a registered trademark of Winbond Electronics Corp. All other trademarks and copyrights mentioned herein are the property of their respective owners.

 

Event Contact

Fely Krewell

(WECA) AUTOMOTIVE PROGRAM MANAGER
TEL: 1-408-5441705
E-mail: FKREWELL@winbond.com

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