Winbond Electronics Corporation Completes Listing of NT$10 Billion Secured Ordinary Corporate Bonds

Hsinchu, Taiwan, Jul.17, 2018-Winbond Electronics Corporation announces today that it successfully issues NT$10 billion secured ordinary corporate bonds. This is the largest secured ordinary corporate bonds under bank guarantee in Taiwan so far this year. It is also the first 7-year secured ordinary corporate bonds issued by Winbond. The bonds, therefore, represent an important milestone for Winbond’s medium- and long-term financing.
Winbond issues the 7-year secured ordinary corporate bonds at a fixed rate of 1% per annum. The bonds are under the guarantee, which was led by Taiwan Cooperative Bank and jointly guaranteed by Bank of Taiwan, CTBC Bank Co., Ltd., Taishin International Bank, Mega International Commercial Bank, DBS Bank Ltd. Taipei Branch, Chang Hwa Commercial Bank, E.Sun Commercial Bank Ltd., First Commercial Bank and Taiwan Business Bank. The ten top banks join the guarantee agreement and provide the guaranteed amount for 1.9 times of issue amount, indicating banks’ recognition of Winbond’s business performance and positive outlook.
Winbond intends to use the fund to finance capital expenditures, repay bank loans, and augment the working capital. The company’s 12-inch fab in Central Taiwan Science Park(CTSP) is going to reach full production capacity next year. The company plans to build a new fab in Kaohsiung Science Park to meet the demand emerging from IoT and other future applications as well as to satisfy Winbond's customer needs. With funds in place, the company will be able to increase the production capacity, further enhance the company’s competitiveness and achieve the growth target of both top and bottom line.

Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer

News Liaison
Mandy Wang
886-3-5678168 #71477

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