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Winbond wins 2020 ASPENCORE World Electronics Achievement Awards

TAICHUNG, Taiwan – November 9, 2020 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME® W77Q Secure Flash has been selected by ASPENCORE analysts and their user community worldwide as one of the winners of 2020 ASPENCORE World Electronics Achievement Awards (WEAA) and received the “Outstanding Product Performance of the Year” award.

The W77Q Secure Flash memory is a revolutionary, drop-in replacement for existing Flash devices, supporting secure storage, secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication
The W77Q ensures robust, end-to-end security in IoT devices by enabling:

Winbond is proud that ASPENCORE recognized its W77Q as the industry’s best Secure Flash device with this award. Winbond’s W77Q Serial Flash contains all the elements required for a safe and resilient IoT with no changes to customer’s platform design. The W77Q series products are supplied in industry-standard packages and pin-outs, supporting standard single/dual/quad/QPI serial peripheral interface (SPI) command set, and allowing a simple drop-in replacement for non-secure SPI NOR Flash devices from all major vendors.

The first W77Q part, in densities of 16Mbit and 32Mbit, is available for sampling now. More information may be found at www.winbond.com.


About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

TrustME® is a trademark of Winbond Electronics Corporation.  All other product names that appear in this material are for identification purposes only and are acknowledged trademarks or registered trademarks of their respective companies.


Product Contact
Hung-Wei Chen
Secure Flash Product Director
TEL: +886-3-567-8168 #71469
E-mail: HWChen8@winbond.com

News Contact
Yulia Lee
Marcom Manager
TEL: +886-3-567-8168 #75395
E-mail: YLLi5@winbond.com

Spokesperson
Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer
TEL: +886-3-567-8168/+886-987-365-682

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