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High performance and low power consumption give Winbond’s 1Gb, LPDDR3 DRAM the edge in Tsing Micro’s new AI image-processing SoC

Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP 
Executing up to 1.2T(Int8), the TX510 SoC sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM

TAICHUNG, Taiwan – December 16, 2020 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved another great success in high bandwidth memory with Tsing Micro latest artificial intelligence (AI) system-on-chip (SoC).

Beijing, China-based Tsing Micro’s TX510 SoC is a highly advanced AI edge computing engine optimized for functions such as 3D sensing, face recognition, object recognition and gesture recognition. Paired with Winbond’s LPDDR3 DRAM, which offers maximum bandwidth of 1866Mb/s and operates from a dual 1.2V/1.8V supply with power-saving features such as Deep Power-Down mode and a Clock Stop capability, the TX510 offers outstanding speed and accuracy in AI imaging applications.

Tsing Micro(www.tsingmicro.com)has implemented an innovative architecture in the TX510 SoC: it includes a 32-bit RISC processor, a reconfigurable neural network engine, a reconfigurable general computing engine, an image signal processor and a 3D sensing engine. For shipping to customers, the TX510 is combined with Winbond’s 1Gb LPDDR3 DRAM die in a single 14mm x 14mm TFBGA System-in-Package (SiP).

Achieving computing throughput of up to 1.2 TOPS (tera operations per second), this SiP can perform accurate face recognition (false acceptance ratio of 1 in 10 million) in less than 100ms, and compare features with a library of 100,000 faces in less than 50ms. Peak operating power consumption is just 450mW, and the chip uses just 0.01mW in quiescent mode.

The TX510 is intended for use in applications which require high-speed image detection and recognition, including biometric sensing, video surveillance, smart retail operations, smart home automation and advanced industrial automation.

Wang Bo, CEO of Tsing Micro, says: “Evaluation of the Winbond LPDDR3 DRAM shows that it is highly competitive both in terms of speed and power consumption. But equally important to us when developing the TX510 was the support and expertise that Winbond provided to us in integrating the DRAM die into a SiP in such a way that it maintained high performance and high signal integrity while taking care of thermal management.”

“Winbond is fast gaining a reputation for providing excellent support to chip and SoC manufacturers which are developing leading-edge AI products. With Winbond low-power DRAM inside, AI products such as the TX510 can set new benchmarks for high performance and throughput while operating from a limited battery power supply,” said Winbond.

Winbond’s LPDDR3 DRAM is in mass production. More information can be found at www.winbond.com

More information about the TX510 can be found at www.tsingmicro.com

 


About Tsing Micro
Beijing Tsing Micro Intelligent Technology Co., Ltd., is a leader in Coarse-grained Reconfigurable Architecture(CGRA)of chip. The Company provides chip products and solutions that are based on the edge side and extend to the cloud side. The core technical team is from the Microelectronics Institute of Tsinghua University. The team has been engaged in new chip architecture design, research and development for 13 years,with capability to chip design, software, algorithms and systems development. CGRA is a new chip architecture technology that can flexibly reconstruct hardware resources according to different applications or algorithms. It is rated as the most promising future computing architecture by the International Semiconductor Technology Roadmap.

About Winbond
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.


Product Contact
Jacky Tseng
DRAM Segment Marketing Manager
TEL: +886-3-5678168 ext 78562
E-mail: yctseng7@winbond.com

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Yulia Lee
Marcom Manager
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E-mail: YLLi5@winbond.com

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Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer
TEL: +886-3-5678168/886-987-365682

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