Hsinchu, Taiwan, March 16, 2021-Winbond Electronics Corporation announced that the capital expenditure for the 12-inch fab had obtained approval from the board of directors meeting on March 16.
The capital expenditures of approximately NT$13,127million approved for the purposes including 1) Installation and expansion of production capacity; 2) Laboratory equipment; 3) Test equipment; 4) Fab facility systems.
The new Kaohsiung Fab's investment will be made starting from March 2021, and a pilot-run phase will begin in 2022. The new Kaohsiung Fab, Winbond’s second 12-inch fab, is expected to fulfill the market demand and customer commitment. The Company will closely watch the market dynamic and supply-demand situation and take a prudent approach for capacity allocation. The new Kaohsiung Fab will enable the Company to enhance its long-term competitiveness in the memory industry.
As a leading global supplier of semiconductor memory solutions , Winbond values the importance of research and development, innovation and global talents.
With the industrial clustering effect driven by the investment, the new Kaohsiung Fab is expected to increase employment opportunities for semiconductor talents to join and work together to provide customer-oriented services and strive towards the goal of becoming a total memory solutions provider.
Spokesperson
Jessica Chiou-Jii Huang
Chief Financial Officer
TEL:
886-3-5678168
886-987-365682
News Liaison
Mandy Wang
TEL:
886-3-5678168 #71477
886-975-995525
E-mail:YCWang16@winbond.com