The new W25N / W72N is a single-level cell (SLC) QspiNAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC).
Winbond new High Performance QspiNAND enables a data transfer rate four times faster than Parallel NAND and other QspiNAND currently on the market. Transferring data at 83MB/s, which far exceeds competing NAND flash on the market, Winbond's new solution accelerates instrument cluster boot-up time.
It also supports dual-quad I/O interface to accommodate higher storage density or data transfer rate up to 166 MB/s. The selection allowing for single, dual and quad I/O means customers can enjoy more flexibility compared to what competitors can offer.Furthermore, Winbond this new High Performance QspiNAND supports hardware reset pin which is more convenient for hardware / software design for automotive applications.
