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High Performance QspiNAND Flash

The new W25N / W72N is a single-level cell (SLC) QspiNAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC).

Winbond new High Performance QspiNAND enables a data transfer rate four times faster than Parallel NAND and other QspiNAND currently on the market. Transferring data at 83MB/s, which far exceeds competing NAND flash on the market, Winbond's new solution accelerates instrument cluster boot-up time.



It also supports dual-quad I/O interface to accommodate higher storage density or data transfer rate up to 166 MB/s. The selection allowing for single, dual and quad I/O means customers can enjoy more flexibility compared to what competitors can offer.Furthermore, Winbond this new High Performance QspiNAND supports hardware reset pin which is more convenient for hardware / software design for automotive applications.


Part No. Voltage Speed Temp. Features Automotive Status Datasheet
W25N01JW 1.7V-1.95V STR166MHz / DTR83MHz -40℃ ~ 85℃ / -40℃ ~ 105℃ SPI / QPI / DTR , On-Chip ECC S P pdf

Status:P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design
All Winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.


Technical Documentation


Product Brief

High Performance QspiNAND Flash Product Brief

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  • File Type:pdf
  • Updated:24/02/2020

High Performance QspiNAND is ready for Automotive Applications

  • File Type:Video
  • Updated:16/05/2019

New High-Performance QspiNAND: A Better High Density Storage Option for Automotive Display

  • File Type:Video
  • Updated:11/12/2018

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