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DDR2 SDRAM ( double-data-rate synchronous dynamic random access memory generation 2 ) is a type of memory used in automotive, industrial, computer and consumer electronics. It achieves greater bandwidth than the preceding DDR SDRAM by higher clock rate.

note: If any request of KGD, please contact us. 

Density

Part No. Voltage Speed Temp. Organization Status Industrial & Commercial Datasheet
Automotive Industrial & Commercial
W972GG6KB 1.8V±0.1V 667 / 800 / 1066 Mbps C-temp, I-temp, Automotive 128Mbitx16 P P pdf
W972GG8KS 1.8V±0.1V 667 / 800 / 1066 Mbps C-temp, I-temp, Automotive 256Mbitx8 P P pdf
Status1：P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design, EOL=End of life.
Status2：All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Automotive3 ：All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

Technical Documentation

Resources

Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

Product Press
CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions. Designed to meet the growing demands of edge AI computing devices, it is compatible with memory density from 256Mb to 8Gb with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.
CUBE, 3DCaaS, Edge_AI , High_Bandwidth

Winbond and Mobiveil Collaborate on Ultra-Low Power Applications

Product Press
Winbond HYPERRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh, Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory, Mobiveil has adapted its HYPERRAM™ Controller to leverage the unique characteristics of Winbond's new HYPERRAM device that reaches speeds of up to 250MHz and supports densities from 32Mb to 512Mb in x8/x16 modes. Integrating Mobiveil's HYPERRAM controller to interface with Winbond's 250MHz HYPERRAM device will provide SoC designers with high performance at very low power.
HYPERRAM, Mobiveil, HYPERBUS, Ultra-LowPower, AHB-Lite

DRAM Flyer

Product Brief
DRAM, Flyer, SpecialtyDRAM, MobileDRAM
  • File Type：PDF
  • Updated：Tue Feb 21 14:57:46 CST 2023
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