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  • Winbond releases SDRAM: 64Mb(W9864 Series), 128Mb(W9812 Series) and 256Mb(W9825 Series)

    In response to the coming of the digital family, Winbond is now targeting the specialty niche DRAM market. Among the specialty DRAM makers, we are one of the few IDM factories, which are capable of in-house research and development, manufacturing and marketing. Apart from providing you with high per...

  • Winbond releases 256Mb LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

  • Winbond Electronics Unveils 256MB LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

  • Winbond Introduces products for broad range applications: 64Mb, 128Mb, and 256Mb SDRAM

    Winbond is introducing new SDRAM products for broad range applications, including: 64Mb (W9864 series), 128Mb (W9812 series), and 256Mb (W9825 series). These products will be on exhibition at the 2007 Taipei Semiconductor Industry Exhibition, and have passed SGS inspection, JGPSSI standards. The SDR...

  • Winbond is attending the Taitronics 2008. We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM.

    Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM that meet the increasing need of low power consumpti...

  • Winbond Electronics has come up with a new low-density DDR3 SDRAM to fulfill the demand of new applications

    Nowadays, info-electronic devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and down-sizing. Fully understanding market...

  • Winbond Flash/DRAM Memory Applied Of Network Communication Electronic Products Online Webinar Host by Winbond Electronics at ChinaECNet

    Registration website: http://seminar.eccn.com/130410/tindex.asp Winbond Electronics Corp. is hosting “Winbond Flash/DRAM Memory Applied of Network Communication Electronic Products Online Webinar” at ChinaECNet at 10AM, April 10. We will make a brief overview of the Internet communications market tr...

  • Winbond to Join in Fujitsu-Toshiba DRAM Development Program

    (Taipei News) Fujitsu Limited, Toshiba Corporation and Winbond Electronics Corp. today announced that Winbond will join their collaborative development program for next-generation memory devices. Begun in January 1999, the 30-plus-billion-yen project has pursued development of 0.13ľm DRAM technology...

  • Winbond and Toshiba Join Hands In DRAM Technology Development

    (Taipei)-- Winbond Electronics Corporation announced today that it is joining with Toshiba Corporation, Japan to co-develop 0.13 micron trench type DRAM memory technology and 512M DRAMs. This is the first joint DRAM process technology development project between Winbond and Toshiba, following a seri...

  • Winbond Electronics Corporation Announces Strategic Alliance with Infineon Technologies AG for 0.11-Micron DRAM Technology

    (Taipei News) Winbond Electronics Corporation today announced the signing of a Memorandum of Understanding (MOU) with Infineon Technologies AG for 0.11-micron DRAM technology. It is the first technology agreement between the two companies. Under the terms of the MOU, Winbond will manufacture commodi...

  • Winbond Electronics Corporation Announces Signing of Definitive Agreement with Infineon Technologies AG for Licensing 0.11-Micron DRAM Technology

    (Taipei News) Winbond Electronics Corporation today announced the signing of a definitive agreement with Infineon Technologies AG for licencing 0.11-micron DRAM technology. The signing of the formal contract marks the first technology agreement between the two companies. Under the terms of the agree...

  • Winbond Plans to Enter Product Transfer and Technology Licensing Agreement with Qimonda AG for Graphic DRAM

    (Taipei news) Winbond Electronics Corporation Board of Directors today approved a proposal to enter product transfer and technology licensing agreement with Qimonda AG for Graphic DRAM business that uses Graphic Double Data Rate (GDDR) specification. The plan is to acquire Qimonda’s GDDR-related pro...

  • Winbond Electronics Corporation and Insolvency Administrator of Qimonda AG Enter a Product Transfer and Technology Licensing Agreement for Graphic DRAM

    Taipei, Taiwan, R.O.C.-August, 12, 2009- Winbond Electronics Corporation today announced entering into a license and sale and purchase agreement regarding Graphics Double Data Rate (GDDR), a 5th addendum to the know how transfer and license agreement, and a settlement agreement for insolvency procee...

  • Winbond Electronics Introduces Intel-Compliant 256Mb DDR400 SDRAM

    Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced its introduction of Intel DDR-400 specification compliant 256Mb DDR SDRAM. With its 3.2G byte/second data transmission bandwidth, this DDR-400 memory solution supports the new Intel 865 chipsets featuring...

  • Winbond to reveal a new-generation Ultra-Low-Power Mobile DRAM solution at the 2018 electronica conference

    MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

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