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Programming Winbond SPI NOR Flash for Xilinx FPGA
https://www.winbond.com/support/technical-support/?__locale=en&docsNo=DA01-AN0000023
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Gowin Semiconductor embeds 64Mb HyperRAM™ DRAM from Winbond to give space and power savings in its latest solution for AI edge computing
Winbond’s HyperRAM™ product offers attractive combination of low pin count, low power consumption and high data bandwidth in miniature KGD form factor TAICHUNG, Taiwan – January 13, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced t...
https://www.winbond.com/hq/about-winbond/news-and-events/news/news00537.html?__locale=en
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Winbond Introduces Industry's First QUAD-SPI Serial Flash Memory
• W25Q16 SpiFlash Memory Offers Single, Dual, Quad I/Os in Space-Saving 8-Pin Package • 320Mhz-Equivalent Clock Rate Gives More than 6X Performance Boost • Cost-Effective, Code-Execution Alternative to Parallel NOR Flash SAN JOSE, Calif. – Aug 7, 2007 -- Winbond Electronics Corporation announced tod...
https://www.winbond.com/hq/about-winbond/news-and-events/news/news00320.html?__locale=en
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Winbond TrustME® Secure Flash Memory achieves PSA Certified™ Level 2 Ready
(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...
https://www.winbond.com/hq/about-winbond/news-and-events/news/news00511.html?__locale=en
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Automotive Flash Product Brief
https://www.winbond.com/productResource-files/DA05-0005.pdf
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Why embedded developers are considering serial NAND Flash for code storage in systems that implement artificial intelligence
The potential for innovation created by artificial intelligence (AI) is exciting embedded developers in every market sector. In fact, it might seem strange to be thinking in terms of ‘innovation’, since the fundamental technology of AI is not itself new: IBM’s Deep Blue AI system beat chess world ch...
https://www.winbond.com/hq/support/online-learning/articles-item/articles00018.html?__locale=en
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Flex Logix pairs its InferX X1 AI inference accelerator with the high-bandwidth Winbond 4Gb LPDDR4X chip to Set a New Benchmark in Edge AI Performance
Winbond’s 4Gb LPDDR4X chip in 200B BGA package offers maximum 4267Mbps data rate at a clock rate up to 2133MHz TAICHUNG, Taiwan and Mountain View, CA– January 27, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, h...
https://www.winbond.com/hq/about-winbond/news-and-events/news/news00538.html?__locale=en