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  • Winbond Announces New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash ® memories support space-saving, cost-effective SO8 package Dual-Output SPI supports more...

  • Winbond announces new Flash Memory products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories o 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture o 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash® memories support space-saving, cost-effective SO8 package o Dual-Output SPI supports...

  • Winbond Introduces Industry's First QUAD-SPI Serial Flash Memory

    • W25Q16 SpiFlash Memory Offers Single, Dual, Quad I/Os in Space-Saving 8-Pin Package • 320Mhz-Equivalent Clock Rate Gives More than 6X Performance Boost • Cost-Effective, Code-Execution Alternative to Parallel NOR Flash SAN JOSE, Calif. – Aug 7, 2007 -- Winbond Electronics Corporation announced tod...

  • Winbond Announces New Flash Memory Products - 16Mb/32Mb/64Mb Parallel Flash

    16 Mb (W19B160B), 32 Mb (W19B320B) and 64 Mb (W19B640C) parallel flash memories 16 Mb and 32 Mb: 70 ns, Boot Block and Single Bank Architecture 64 Mb: 70 ns, Boot Block (supports page mode), and Flexible Bank Architecture (Hsinchu, Taiwan – Sep 17, 2007)Over the past 12 years, Winbond has devoted it...

  • Winbond Flash/DRAM Memory Applied Of Network Communication Electronic Products Online Webinar Host by Winbond Electronics at ChinaECNet

    Registration website: http://seminar.eccn.com/130410/tindex.asp Winbond Electronics Corp. is hosting “Winbond Flash/DRAM Memory Applied of Network Communication Electronic Products Online Webinar” at ChinaECNet at 10AM, April 10. We will make a brief overview of the Internet communications market tr...

  • Winbond Acquires NexFlash Technology

    Winbond Electronics Corporation today announced it has acquired 46% in stock shares of NexFlash Technology, Inc. via Winbond's wholly-owned overseas subsidiary - Winbond International Corporation. Winbond first acquired 54% of Nexflash stock in January 2001. With this acquisition of the remaining 46...

  • Winbond Introduces First Very-Low-Voltage Flash Memories

    New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

  • [Re-scheduled] Winbond seminar- How innovation is bringing new value and new functionality to systems using code-storage Flash ICs

    Sorry, the seminar has been rescheduled and we will get back to you New Memory and Security Technologies for Designers of IoT Devices Designs for new connected devices of all types have to fulfil tough new requirements to succeed in a competitive market. In many cases, Internet of Things (IoT) edge ...

  • Winbond introduces new class of high-quality NAND Flash to provide lower cost alternative to NOR Flash for code storage in mission-critical applications

    High Quality NAND Flash from Winbond to give automotive system manufacturers new pathway to higher-density code memory as NOR Flash scaling reaches its limit NUREMBERG, Germany and TAICHUNG, Taiwan – 27 February, 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor mem...

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