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  • New Memory and Security Technologies for Designers of IoT Devices

    Internet of Things (IoT) edge nodes are battery-powered, often portable, and are connected to an internet gateway or access point wirelessly. This means that the most important constraints on new IoT designs are space, power and security. Check out how Winbond develops more power-efficient and secur...

  • Winbond and Tiempo Secure join forces to offer the world’s first fully CC EAL5+ certifiable Secure Element IP for IoT

    Munich, Germany – 13 November, 2018 -- Winbond Electronics Corporation and Tiempo Secure are announcing a complete solution for certifiable Secure Elements comprised of Tiempo Secure’s fully proven hard macro IP and Winbond’s certified secure flash. The combined solution offers cloud to IoT authenti...

  • Winbond moves into HyperRAM® market to address new AIoT application needs

    (HSINCHU, Taiwan –30 October, 2019)With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppl...

  • How efficient memory solutions can help designers of IoT nodes meet tight BoM cost targets

    Industry’s vision for the Internet of Things (IoT) foresees the installation of billions of devices connected to the world’s universal network. All forecasts for the numbers of IoT nodes are huge. Simple mathematical reasoning suggests that the average production cost per node must be small, otherwi...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporation at International Common Criteria Conference 2015 (ICCC 2015)

    Dates: September 22 to 24, 2015 Location: London, England Winbond Electronics Corporation is pleased to announce the participation in the upcoming ICCC 2015 (International Common Criteria Conference 2015) as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s in...

  • Winbond to Use Rambus Cryptography Research Division Security Measures to Safeguard Data Integrity

    Winbond to Use Rambus Cryptography Research Division Security Measures to Safeguard Data Integrity Hardware-based security technology will protect sensitive data and encrypted transactions in flash devices SUNNYVALE, Calif. – September 22, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced that Winbon...

  • Winbond Electronics Corporation at GlobalPlatform Trusted Execution Environment (TEE) Conference 2015

    Date: October 13, 2015 Location: Santa Clara, California, USA Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporation at GlobalPlatform Trusted Execution Environment (TEE) Conference 2015

    Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s innovative secure memory solutions, TrustMETM: the ...

  • Winbond Electronics Corporations in electronica 2016

    Winbond Electronics Corporation is attending the upcoming electronica 2016, 27th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automotive, Industrial and Internet of Things (IoT) For more information about the electronica 2016, pleas...

  • Winbond Introduces First Very-Low-Voltage Flash Memories

    New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

  • [Re-scheduled] Winbond seminar- How innovation is bringing new value and new functionality to systems using code-storage Flash ICs

    Sorry, the seminar has been rescheduled and we will get back to you New Memory and Security Technologies for Designers of IoT Devices Designs for new connected devices of all types have to fulfil tough new requirements to succeed in a competitive market. In many cases, Internet of Things (IoT) edge ...

  • Winbond Electronics Corporation in electronica 2018

    Winbond Electronics Corporation is attending the upcoming electronica 2018, international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automotive, Industrial and Internet of Things (IoT) For more information about the electronica 2018, please vis...

  • Yuan-Mou Su, Vice Chairman & Deputy CEO of Winbond, was invited as a guest speaker in IC60 Master Forum, SEMICON Taiwan2018

    Yuan-Mou Su, the Vice Chairman & Deputy CEO of Winbond Electronics Corp., was invited to participate in the "SEMICON Taiwan 2018 International Semiconductor Exhibition" and "IC 60 Master Forum" on September 5, 2018, and delivered a speech titled "Keep Your AIoT Data Safe with Secure Memory Solutions...

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