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  • Meets industrial and automotive temperature requirement with the longest product life in the Market!!

    (Hsinchu, Taiwan – June 22, 2015) Winbond introduced latest 2Gb DDR2 DRAM that not only meets industrial/automotive temperature requirement operating from -40°C (LT) to 95°C (AG3)/105°C(AG2)/115°C (AG2 plus) but also fully complies with AEC-Q100 qualification standards (the Stress Test Qualification...

  • Winbond moves into HyperRAM® market to address new AIoT application needs

    (HSINCHU, Taiwan –30 October, 2019)With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppl...

  • Winbond Electronics Enters Automotive Flash Memory Market

    Winbond Electronics Enters Automotive Flash Memory Market Serial Flash Memory Leader Applies its Design, Manufacturing Expertise to Provide TS16949-Certified, AEC-Q100-Qualified Devices to Rapidly Expanding Market SAN JOSE, Calif., USA – Feb. 27, 2012 --Winbond Electronics Corp., a leading global su...

  • Code Storage Flash Memory - NAND Based MCP

    Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB (Printed Circuit Board). This benefit becomes more critical in small PCBs for ...


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