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  • Code Storage Flash Memory - NAND Based MCP

    Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB (Printed Circuit Board). This benefit becomes more critical in small PCBs for ...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Introduces Industry's First QUAD-SPI Serial Flash Memory

    • W25Q16 SpiFlash Memory Offers Single, Dual, Quad I/Os in Space-Saving 8-Pin Package • 320Mhz-Equivalent Clock Rate Gives More than 6X Performance Boost • Cost-Effective, Code-Execution Alternative to Parallel NOR Flash SAN JOSE, Calif. – Aug 7, 2007 -- Winbond Electronics Corporation announced tod...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Date : Sep/5/2007-Sep/8/2007 Location : Hangzhou Peace International Exhibition & Conference Center Booth : H13-23, G14-24 Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufactur...

  • Winbond ships one billionth serial flash memory, ramps 90nm production, increases market share

    WINBOND SHIPS ONE BILLIONTH SERIAL FLASH MEMORY, RAMPS 90NM PRODUCTION, INCREASES MARKET SHARE · First Serial Flash Supplier in Full Production at 12-inch Wafer Fabrication Facility · Expands Family of 90nm Multi I/O SpiFlash Memories from 1 to 128 Megabits Taichung, Taiwan – April 12, 2010 -- Winbo...

  • Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application

    Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application Winbond Announces New 512Mbit mobile LPSDRAM Mar/31/2011 512M mobile LPSDRAM W989D6C, W989D2C, Mobile LPSDR: 166MHz, respectively, supporting x16/x32 data widths W949D6C, W949D2C, Mobile LPDD...

  • Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 Americas

    Date : 2014/4/8-2014/4/11 Location : Dallas, Texas at the Gaylord Texan Resort& Convention Center Booth : Space Plus Winbond Electronics Corporation America will participate in the Freescale Technology Forum (FTF) 2014 Americas as a Silver Sponsor. Come visit Winbond in the Technology Lab April 8 to...

  • Winbond Introduces 1Gb and 2Gb SpiFlash Memories in 8-Pin Package for Space-Limited Code-Storage Applications

    SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – March 11, 2015 – Winbond Electronics Corporation today announced a dramatic expansion of its Flash product portfolio with introduction of a new family of high-density SpiFlash® memories. The new family, the W25N Series, achieves both high-performance rea...

  • Winbond Introduces First SpiStack Memories in 8-Pin Packages

    New Devices Offer Unmatched Flexibility in Combining Densities for Variety of Applications SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – March 24, 2016 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash pr...

  • Winbond Becomes Siemens’ Memory Supplier for Industrial Application

    Hsinchu, Taiwan, 03.07, 2017- Winbond Electronics Corporation (TSE:2344) , a worldwide leading supplier of specialty memory, announced it has signed a general quality agreement with Siemens, the world market leader in solutions for industrial market, for memory supply. It shows that the outstanding ...

  • Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 Americas

    Winbond Electronics Corporation America will participate in the Freescale Technology Forum (FTF) 2014 Americas as a Silver Sponsor. Come visit Winbond in the Technology Lab April 8 to 10, 2014 to learn more about our memory solutions for internet of Things (IoT). More information at www.freescale.co...

  • Winbond Introduces Multiple Key Chips and IC Design Technologies at 2008 IIC-China

    Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. We are proud to introduce multiple Winbond IC designs as well as new products at the Shenzhen Convention and Exhibition Center (March 3th and 4th) and Shanghai Mart Expo (March 10th and 11th). Ou...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce. Multiple Winb...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Taitronics Bangkok 2007

    Winbond Electronics Corp. will attend the upcoming Taitronics Bangkok 2007 Exhibition hosted by the Taipei World Trade Center (TWTC), Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), and Thai-Taiwan Business Association (TTBA). Multiple Winbond IC designs as well as new products ...

  • Winbond will Display Multiple Key Chips and IC Design Technologies at 2007 SemiTech Taipei Exhibition

    Winbond will attend the upcoming SemiTech Taipei (STT) Exhibition hosted by Taiwan Semiconductor Industry Association(TSIA) and Taipei Computer Association(TCA). Multiple Winbond IC designs as well as new products will be on display at theTaipei world Trade Center (May 10 th and 12 th). Our complete...

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