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  • Code Storage Flash Memory - NAND Based MCP

    Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB (Printed Circuit Board). This benefit becomes more critical in small PCBs for ...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Introduces Industry's First QUAD-SPI Serial Flash Memory

    • W25Q16 SpiFlash Memory Offers Single, Dual, Quad I/Os in Space-Saving 8-Pin Package • 320Mhz-Equivalent Clock Rate Gives More than 6X Performance Boost • Cost-Effective, Code-Execution Alternative to Parallel NOR Flash SAN JOSE, Calif. – Aug 7, 2007 -- Winbond Electronics Corporation announced tod...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Date : Sep/5/2007-Sep/8/2007 Location : Hangzhou Peace International Exhibition & Conference Center Booth : H13-23, G14-24 Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufactur...

  • Winbond Introduces First SpiStack Memories in 8-Pin Packages

    New Devices Offer Unmatched Flexibility in Combining Densities for Variety of Applications SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – March 24, 2016 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash pr...

  • Winbond Becomes Siemens’ Memory Supplier for Industrial Application

    Hsinchu, Taiwan, 03.07, 2017- Winbond Electronics Corporation (TSE:2344) , a worldwide leading supplier of specialty memory, announced it has signed a general quality agreement with Siemens, the world market leader in solutions for industrial market, for memory supply. It shows that the outstanding ...

  • Winbond Introduces Multiple Key Chips and IC Design Technologies at 2008 IIC-China

    Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. We are proud to introduce multiple Winbond IC designs as well as new products at the Shenzhen Convention and Exhibition Center (March 3th and 4th) and Shanghai Mart Expo (March 10th and 11th). Ou...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce. Multiple Winb...

  • Winbond will Display Multiple Key Chips and IC Design Technologies at 2007 SemiTech Taipei Exhibition

    Winbond will attend the upcoming SemiTech Taipei (STT) Exhibition hosted by Taiwan Semiconductor Industry Association(TSIA) and Taipei Computer Association(TCA). Multiple Winbond IC designs as well as new products will be on display at theTaipei world Trade Center (May 10 th and 12 th). Our complete...

  • Winbond to Join in Fujitsu-Toshiba DRAM Development Program

    (Taipei News) Fujitsu Limited, Toshiba Corporation and Winbond Electronics Corp. today announced that Winbond will join their collaborative development program for next-generation memory devices. Begun in January 1999, the 30-plus-billion-yen project has pursued development of 0.13ľm DRAM technology...

  • Winbond Announces Corporate Reorganization Winbond Announces Corporate Reorganization

    (Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows: Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM wafer fab, has been assigned to mana...

  • Winbond Assists National Chi Nan University in Establishing New Multimedia & Communications Lab

    (Taipei News) Winbond Electronics Corporation today announced that on behalf of the corporation, Winbond's President, Dr. C. C. Chang, has donated NT$1.2 million and multimedia and communications equipment to the National Chi Nan University. The equipment, which was warmly received by both teachers ...

  • Winbond Electronics Corporation Announces Signing of Definitive Agreement with Infineon Technologies AG for Licensing 0.11-Micron DRAM Technology

    (Taipei News) Winbond Electronics Corporation today announced the signing of a definitive agreement with Infineon Technologies AG for licencing 0.11-micron DRAM technology. The signing of the formal contract marks the first technology agreement between the two companies. Under the terms of the agree...

  • Winbond Comments on the Announcement That Qimonda AG Has Filed a Petition in Germany for Its Financial Restructuring Program

    (Taipei News) Winbond Comments on the Announcement that Qimonda AG has filed a petition in Germany for its financial restructuring program as below. As of today, the unpaid accounts receivable for DRAM wafers shipped to Qimonda are about NTD 950 million. In regard to the 16,000 wafers shipped to Qim...

  • Winbond Makes Additional Comments on the Announcement That Qimonda AG Has Filed a Petition in Germany for Its Financial Restructuring Program

    As of today, the unpaid accounts receivable for DRAM wafers shipped to Qimonda are about NTD 950 million. Of which, around NTD 600 million accounts receivable occurred before the end of December, 2008. Owing to the long procedure of claims and the conservative financial principles, around NTD 600 mi...

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