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  • Winbond releases Pseudo SRAM(W96 Series)

    At this year's eMEX 2006, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Frequ...

  • Winbond releases 256Mb LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Electronics Releases Largest Capacity Pseudo SRAM on the Market

    At this year's IIC 2007, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Freque...

  • Winbond Electronics Unveils 256MB LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

  • Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

  • Winbond Electronics Presents Low Power Mobile Memory

    Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

  • Winbond is attending the Taitronics 2008. We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM.

    Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM that meet the increasing need of low power consumpti...

  • Winbond Reports the Financial Results for the Third Quarter of 2010

    Hsinchu, Taiwan, October 29, 2010-Winbond Electronics Corporation announced the results of audited financial statements for the third quarter of 2010 which have been approved by the Board of Directors. Revenue for the third quarter rose 1% QoQ and 51% YoY to NT$8.574 billion due to inventory adjustm...

  • Winbond Announces the Financial Results for the Second Quarter of 2011

    Hsinchu, Taiwan, August 05, 2011- Winbond Electronics Corporation today announced the financial results for the second quarter of 2011. Revenue for the second quarter totaled NT$7.42 billion, up 4% QoQ and down 13% YoY. Net income for the second quarter was NT$269 million; earnings per share was NT$...

  • Winbond Announces the Financial Results for the Second Quarter of 2014

    Hsinchu, Taiwan, Aug. 01, 2014- Winbond Electronics Corporation today announced the financial results for the second quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.742 billion, up 11% QoQ. Gross margin wa...

  • Winbond Announces the Financial Results for the First Quarter of 2014

    Hsinchu, Taiwan, Apr. 25, 2014- Winbond Electronics Corporation today announced the financial results for the first quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$8.751 billion, up 5% QoQ. Gross margin was ...

  • Winbond Announces the Financial Results for the Third Quarter of 2014

    Hsinchu, Taiwan, Oct. 24, 2014- Winbond Electronics Corporation today announced the financial results for the third quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.931 billion, up 2% QoQ. Gross margin was ...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Announces the Financial Results for the Fourth Quarter of 2014

    Hsinchu, Taiwan, Feb.03, 2015- Winbond Electronics Corporation today announced the financial results for the fourth quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.565 billion, down 4% QoQ. Gross margin wa...

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