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  • Winbond Electronics Corporation Completes Listing of NT$10 Billion Secured Ordinary Corporate Bonds

    Hsinchu, Taiwan, Jul.17, 2018-Winbond Electronics Corporation announces today that it successfully issues NT$10 billion secured ordinary corporate bonds. This is the largest secured ordinary corporate bonds under bank guarantee in Taiwan so far this year. It is also the first 7-year secured ordinary...

  • Winbond collaborate with DNP for the large density memory eSIM and Secure Element Development

    Tokyo, Japan and Taichung, Taiwan – 07 December 2018 -- Winbond Electronics Corporation (hereinafter: WB), a leading global supplier of semiconductor memory solutions in Taiwan, collaborates with Dai Nippon Printing Co., Ltd. (hereinafter: DNP) to increase the security level of IoT (Internet of Thin...

  • Winbond Electronics Corporation Secured an NT$42 Billion 7-year Syndication Loan Agreement

    Hsinchu, Taiwan,January 14, 2019- Winbond Electronics Corporation today secured an NT$42 billion 7-year syndication loan. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. Joseph Jye-Cherng Lyu, Chairman of Bank of Taiwan at Le Meridien Taipei. There are total 19 ...

  • Winbond TrustME® Secure Flash Memory achieves PSA Certified™ Level 2 Ready

    (Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...

  • Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity

    The partnership will be inclusive of major key provisioning, trusted storage of credentials and lifecycle management through Winbond TrustME® Secure Flash Memory combined with Secure-IC’s SecuryzrTM product for accelerated cybersecurity on connected platforms for secure boot, root of trust, executed...

  • Winbond Introduces TrustME® Secure Flash Memory Implementing the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture

    TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Arc...

  • Winbond Introduces TrustME® Secure Flash Memory aligned with Platform Security Architecture from Arm

    TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...

  • Winbond and Tiempo Secure join forces to offer the world’s first fully CC EAL5+ certifiable Secure Element IP for IoT

    Munich, Germany – 13 November, 2018 -- Winbond Electronics Corporation and Tiempo Secure are announcing a complete solution for certifiable Secure Elements comprised of Tiempo Secure’s fully proven hard macro IP and Winbond’s certified secure flash. The combined solution offers cloud to IoT authenti...

  • Winbond’s Secure Flash portfolio on show at electronica provides secure external storage for code and data in SoC- and processor-based systems

    W75 and W77 series of Secure Flash devices protect data in connected and IoT devices from a wide range of hacking attacks and other security threats. W76 Secure Element provides certified solution for eUICC, mobile payments and other security-critical applications. Munich, Germany – 13 November, 201...

  • Winbond Introduces TrustME® Secure Flash Memory aligned with Platform Security Architecture from Arm

    TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...

  • Drop-in replacement Secure Flash for IoT devices - W77Q (Part 1)

    In today's webinar, we are going to talk about... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication. Register no...

  • Are IoT Devices Secure?

    Winbond W77Q Secure Flash Memory for a safe connected world.

  • Code Storage Flash Memory - W77Q - TrustME Secure Memory

    W77Q series of Secure Flash memory devices is a drop-in replacement for standard flash devices. It supports secure boot and system level resilience and provides strong protection for operations such as over-the-air updates and device authentication. The new W77Q enables hardware root-of-trust and se...

  • Winbond TrustME Secure Flash - A Robust and Certifiable Secure Storage Solution

    Winbond has introduced the TrustME secure flash products to address the challenge of combining security with advanced process nodes and remove the barriers for adding secure non-volatile storage to practically any process node out there.

  • TrustME - W75F Secure Memory Element

    W75F Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL5+ certificate. W75F enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UICC...

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