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Winbond leads the era of wearable devices with the launch of HyperRAM™ WLCSP package
HyperRAMTM devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...
https://www.winbond.com/hq/about-winbond/news-and-events/news/news00520.html?__locale=en
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W25Q256JW_DTR Data Sheet
https://www.winbond.com/resource-files/W25Q256JW_DTR RevI 08062020.pdf
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W25Q80NE
8M-bit 1.2V Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI Features Dual/Quad Serial Peripheral Interface Uniform 4KB erasable sectors & 32KB/64KB erasable blocks 4,096 pages (256 bytes) Single/Dual/Quad Fast Read instructions 8/16/32/64byte wrap around for Fast Read Dual/Quad I/O in...
https://www.winbond.com/hq/product/code-storage-flash-memory/1.2v-serial-nor-flash/item/W25Q80NE.html?__locale=en
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Winbond Introduces First Very-Low-Voltage Flash Memories
New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...
https://www.winbond.com/hq/about-winbond/news-and-events/news/news00437.html?__locale=en
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Product selection
https://www.winbond.com/hq/support/faq/technical/.content/faq/faq00001.html?__locale=en
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Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications
Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications Densities from 512Kb to 16Mb; USON, WLBGA Packages Reduce Footprint by 80% or more SAN JOSE, Calif., USA, and TAICHUNG, Taiwan– November 16, 2011 -- Winbond Electronics Corp., a leading global su...
https://www.winbond.com/hq/about-winbond/news-and-events/news/news00332.html?__locale=en
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What You Need to Know about HyperRAM™ – An Alternative Memory Option
What is HyperRAM™? Before knowing HyperRAM™, one should understand HyperBus™ first. HyperBus™ technology was first unveiled by Cypress in 2014, and according to Cypress, “the HyperBus™ interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system per...
https://www.winbond.com/hq/support/online-learning/articles-item/articles00017.html?__locale=en