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  • Winbond Introduces First Very-Low-Voltage Flash Memories

    New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

  • Winbond to reveal a new-generation Ultra-Low-Power Mobile DRAM solution at the 2018 electronica conference

    MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

  • Mobile DRAM

    Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond th...

  • Code Storage Flash Memory - 1.2V Serial NOR Flash

    The W25QxxND 1.2V series parts have performance identical to the popular 3V and 1.8V families of serial flash with the added benefit of saving power. They are offered in 2mm x 3mm USON8, narrow 150mil SOP8, 6x5mm WSON 8-pin packages and KGD (Known Good Die) which provide designers with the convenien...

  • The keys to successful adoption of new low-voltage memory ICs

    Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...

  • Winbond moves into HyperRAM® market to address new AIoT application needs

    (HSINCHU, Taiwan –30 October, 2019)With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppl...


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