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  • Winbond extends performance of Serial NAND Flash Memory with new 1Gbit device offering maximum data-transfer rate of 83MB/s

    New W25N01JW NAND Flash IC offers reliable, lower-cost alternative to SPI NOR Flash in 1Gbit and 2Gbit capacities for automotive displays and instrument clusters TAICHUNG CITY, Taiwan – 05 June, 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, tod...

  • How new diagnostic data and operations equip Flash memory ICs for the demands of the automotive functional safety standard

    NOR Flash has been a dependable technology in vehicles for many years, and today is used in various automotive systems, including the instrument cluster and in infotainment and telematics systems (see Figure 1). In these applications, this non-volatile memory provides storage capacity for applicatio...

  • New High-Performance Serial NAND: A Better High Density Storage Option for Automotive Display

    The automotive requirements: speed, reliability and compatibility. Winbond's high-performance serial NAND Flash technology offers both cost and performance advantages over the SPI NOR Flash typically used today in the instrument cluster and in automotive display systems.

  • New high-performance serial NAND: a better high-density storage option for sophisticated automotive display applications?

    Automotive displays, both in the instrument cluster and in the Centre Information Display (CID), or head unit, are becoming larger, more sophisticated and more numerous. Thanks to the popularity of devices such as tablets and smartphones, car users have grown accustomed to interacting with technolog...

  • Winbond Memory Solution for Your Automotive

    There will be more IoT devices connected to cars in the future. Traditional Auto-Electronics like GPS/Infotainment, Cluster Controller and Engine Control use NOR-Flash and NAND-Flash. Winbond will focus on new segments such as ADAS and ADAS system programming as well as software stacks for autonomou...

  • Winbond responds to market challenge with High Performance Serial NAND Tapping into explosive growth in demand for automotive memory

    Demand for automotive memory is showing explosive growth in recent years as a result of maturing ADAS technology, increasing demand for in-vehicle infotainment systems and automotive display as well as instrument cluster display gradually upgrading from conventional 4.5-inch panels to 12.3-inch smar...

  • Code Storage Flash Memory - High Performance Serial NAND Flash

    The new W25N / W72N is a single-level cell (SLC) serial NAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC). Winbond new High Performance Serial NAND enables a data transf...

  • Winbond Holds Groundbreaking Ceremony for New Fab at Kaohsiung Science Park of Southern Taiwan Science Park

    Winbond Electronics Corp. held the groundbreaking ceremony for its new Kaohsiung Fab at Kaohsiung Science Park of Southern Taiwan Science Park (STSP) today. The new Kaohsiung Fab, Winbond’s second 12-inch fab, is expected to fulfill the market demand and the commitment to customers. It will mark ano...

  • How Serial Flash technology is evolving to meet the new requirements of Industry 4.0 designs

    The famous fourth industrial revolution, tagged ‘Industry 4.0’, is based on the move to digitize industrial equipment and processes on a massive scale. This Industry 4.0 trend is now stretching the capabilities of almost every important category of electronic component used in industrial machines an...

  • Space-saving Winbond NOR+NAND dual-die memory chip now supports NXP Layerscape LS1012A

    Winbond’s W25M161AW SpiStack product in an 8mm x 6mm package provides 16Mbits of NOR Flash for boot code and 1Gbit of NAND for a Linux ® or other full-featured operating system (Santa Clara, California – 6 August, 2019) - Winbond Electronics Corporation, a leading global supplier of semiconductor me...


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