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  • Meets industrial and automotive temperature requirement with the longest product life in the Market!!

    (Hsinchu, Taiwan – June 22, 2015) Winbond introduced latest 2Gb DDR2 DRAM that not only meets industrial/automotive temperature requirement operating from -40°C (LT) to 95°C (AG3)/105°C(AG2)/115°C (AG2 plus) but also fully complies with AEC-Q100 qualification standards (the Stress Test Qualification...

  • W25Q256JV_DTR Data Sheet

  • W25Q128JV Data sheet

  • Winbond Electronics Corporation Signed an NT$ 9 Billion Syndicated Loan Agreement

    Hsinchu, Taiwan, July 07, 2014-Winbond Electronics Corporation today announced that it has signed an NT$ 9 billion five-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. James Chen, President of Chinatrust Commercial Bank at Sherwoo...

  • Winbond Announces the Financial Results for the Third Quarter of 2014

    Hsinchu, Taiwan, Oct. 24, 2014- Winbond Electronics Corporation today announced the financial results for the third quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.931 billion, up 2% QoQ. Gross margin was ...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporation at International Common Criteria Conference 2015 (ICCC 2015)

    Dates: September 22 to 24, 2015 Location: London, England Winbond Electronics Corporation is pleased to announce the participation in the upcoming ICCC 2015 (International Common Criteria Conference 2015) as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s in...

  • Winbond Electronics Corporation at GlobalPlatform Trusted Execution Environment (TEE) Conference 2015

    Date: October 13, 2015 Location: Santa Clara, California, USA Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about...

  • Winbond Announces the Financial Results for the Fourth Quarter of 2015

    Hsinchu, Taiwan, Jan.29, 2016- Winbond Electronics Corporation today announced the financial results for the fourth quarter of 2015. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales in Q4, 2015 were NT$9.84 billion, up 3% QoQ. Gross ...

  • Winbond Announces the Financial Results for the First Half of 2016

    Hsinchu, Taiwan, July.28, 2016- Winbond Electronics Corporation today announced the financial results for the first half of 2016. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales in the first half of 2016 were NT$20.584 billion, up 8...

  • Winbond Electronics has come up with a new low-density DDR3 SDRAM to fulfill the demand of new applications

    Nowadays, info-electronic devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and down-sizing. Fully understanding market...

  • Winbond Becomes Siemens’ Memory Supplier for Industrial Application

    Hsinchu, Taiwan, 03.07, 2017- Winbond Electronics Corporation (TSE:2344) , a worldwide leading supplier of specialty memory, announced it has signed a general quality agreement with Siemens, the world market leader in solutions for industrial market, for memory supply. It shows that the outstanding ...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporation at GlobalPlatform Trusted Execution Environment (TEE) Conference 2015

    Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s innovative secure memory solutions, TrustMETM: the ...

  • Winbond Electronics Corporations in electronica 2016

    Winbond Electronics Corporation is attending the upcoming electronica 2016, 27th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automotive, Industrial and Internet of Things (IoT) For more information about the electronica 2016, pleas...

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