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  • Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application

    Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...

  • Winbond extends performance of Serial NAND Flash Memory with new 1Gbit device offering maximum data-transfer rate of 83MB/s

    New W25N01JW NAND Flash IC offers reliable, lower-cost alternative to SPI NOR Flash in 1Gbit and 2Gbit capacities for automotive displays and instrument clusters TAICHUNG CITY, Taiwan – 05 June, 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, tod...

  • How new diagnostic data and operations equip Flash memory ICs for the demands of the automotive functional safety standard

    NOR Flash has been a dependable technology in vehicles for many years, and today is used in various automotive systems, including the instrument cluster and in infotainment and telematics systems (see Figure 1). In these applications, this non-volatile memory provides storage capacity for applicatio...

  • New High-Performance Serial NAND: A Better High Density Storage Option for Automotive Display

    The automotive requirements: speed, reliability and compatibility. Winbond's high-performance serial NAND Flash technology offers both cost and performance advantages over the SPI NOR Flash typically used today in the instrument cluster and in automotive display systems.

  • New high-performance serial NAND: a better high-density storage option for sophisticated automotive display applications?

    Automotive displays, both in the instrument cluster and in the Centre Information Display (CID), or head unit, are becoming larger, more sophisticated and more numerous. Thanks to the popularity of devices such as tablets and smartphones, car users have grown accustomed to interacting with technolog...

  • Code Storage Flash Memory - High Performance Serial NAND Flash

    The new W25N / W72N is a single-level cell (SLC) serial NAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC). Winbond new High Performance Serial NAND enables a data transf...

  • Winbond responds to market challenge with High Performance Serial NAND Tapping into explosive growth in demand for automotive memory

    Demand for automotive memory is showing explosive growth in recent years as a result of maturing ADAS technology, increasing demand for in-vehicle infotainment systems and automotive display as well as instrument cluster display gradually upgrading from conventional 4.5-inch panels to 12.3-inch smar...

  • Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications

    Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications Densities from 512Kb to 16Mb; USON, WLBGA Packages Reduce Footprint by 80% or more SAN JOSE, Calif., USA, and TAICHUNG, Taiwan– November 16, 2011 -- Winbond Electronics Corp., a leading global su...

  • Winbond Announces Corporate Reorganization Winbond Announces Corporate Reorganization

    (Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows: Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM wafer fab, has been assigned to mana...

  • Winbond Electronics Corporation Names Tsuyoshi Kawanishi As Company's Newest Board Member

    (Taipei News) Winbond Electronics Corporation announced today that Mr. Tsuyoshi Kawanishi has become the Corporation newest board member . Winbond's Chairman of the Board, Mr. Arthur Chiao noted, "During his nearly half of a century in the semiconductor business, Mr. Kawanishi has presented remarkab...

  • Winbond Appoints Mr. Hui-Ming Cheng as New CFO Corporate Finance, 2000

    (Taipei News) Winbond Electronics Corporation today announced that as of December 11, 2000, the company has appointed Mr. Hui-Ming Cheng as the Vice President and Chief Financial Officer (CFO) of the Financial Center for Winbond Electronics Corporation. Mr. Cheng will be responsible for overseeing t...

  • Winbond Electronics Corporation Announces The Resignation of Vice Chairman Ding Yuan Yang

    (Hsin Chu News) Winbond Electronics Corporation today announced the resignation of Winbond's Vice Chairman, Dr. Ding Yuan Yang. Dr.Yang's resignation began January 1, 2002. Vice Chairman Yang is resigning to devote more time to personal pursuits. In 1987, Dr.Yang, along with a group of talented tech...

  • Winbond Announces Dr. Keh Shew Lu as the New Board Member

    (Taipei News) Winbond Electronics Corporation today announced that effective July 1 2002, the Company's corporate director and auditor, Walsin Lihwa Corporation, has appointed Dr. Keh Shew Lu as Winbond's representative. Winbond's Chairman, Arthur Chiao noted, "A Company's core management includes a...

  • Winbond Monthly Revenue Report For February, 2000

    Revenue for the month of February was NT$2.88 billion, an increase of nearly 30% compared to NT$2.21 billion over the same period last year. The accumulated revenue for January and February 2000 is approximately NT$6.42 billion, an increase of 49.7% compared to NT$4.29 billion over the same two-mont...

  • How Serial Flash technology is evolving to meet the new requirements of Industry 4.0 designs

    The famous fourth industrial revolution, tagged ‘Industry 4.0’, is based on the move to digitize industrial equipment and processes on a massive scale. This Industry 4.0 trend is now stretching the capabilities of almost every important category of electronic component used in industrial machines an...

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