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  • Winbond is attending the Taitronics 2008. We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM.

    Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM that meet the increasing need of low power consumpti...

  • Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application

    Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application Winbond Announces New 512Mbit mobile LPSDRAM Mar/31/2011 512M mobile LPSDRAM W989D6C, W989D2C, Mobile LPSDR: 166MHz, respectively, supporting x16/x32 data widths W949D6C, W949D2C, Mobile LPDD...

  • Combining deep power-down with self-refresh mode: new opportunity for power savings in mobile DRAM

    Today, the mobile phone has become the consumer’s favourite device, carried everywhere and never out of reach morning, noon and night. Even so, it is a fact that for most users most of the time, the mobile phone remains in a quiescent state. While the phone is kept continuously switched on, most of ...

  • Winbond releases Pseudo SRAM(W96 Series)

    At this year's eMEX 2006, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Frequ...

  • Winbond releases 256Mb LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Electronics Releases Largest Capacity Pseudo SRAM on the Market

    At this year's IIC 2007, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Freque...

  • Winbond Electronics Unveils 256MB LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

  • Winbond Electronics Releases Largest Capacity CellularRAM on the Market

    SemiTech Taipei 2007, May, 10~12, 2007- With the emergence of a new generation of handheld devices, Winbond Electronics Corp. brings 256 Mb Pseudo SRAM to the market. Focusing on niche memory IDM, Winbond launches largest available 256 Mb CellularRAM standard PSRAM; this density is the best choice f...

  • Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Date : Sep/5/2007-Sep/8/2007 Location : Hangzhou Peace International Exhibition & Conference Center Booth : H13-23, G14-24 Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufactur...

  • Winbond Releases Multiple Key Chips and IC Design Technologies at 2007 eMEX Suzhou

    Date : Oct/18/2007~Oct/21/2007 Location : Suzhou International Expo Center(Expo Plaza, Suzhou Industrial Park) Booth : 4I28, 4B Hall Winbond Electronics Corp. will attend the upcoming 2007 eMEX, Suzhou, China. Winbond together with WTC Walsin PSA (Passive System Alliance) Group* will join eMEX to de...

  • Winbond Electronics Presents Low Power Mobile Memory

    Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

  • Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications

    Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications Densities from 512Kb to 16Mb; USON, WLBGA Packages Reduce Footprint by 80% or more SAN JOSE, Calif., USA, and TAICHUNG, Taiwan– November 16, 2011 -- Winbond Electronics Corp., a leading global su...

  • Winbond Reports the Financial Results for the Third Quarter of 2010

    Hsinchu, Taiwan, October 29, 2010-Winbond Electronics Corporation announced the results of audited financial statements for the third quarter of 2010 which have been approved by the Board of Directors. Revenue for the third quarter rose 1% QoQ and 51% YoY to NT$8.574 billion due to inventory adjustm...

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