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  • Winbond and Karamba Security Partner for Embedded Cybersecurity

    The partnership will extend runtime integrity protection with secure NOR flash to improve cybersecurity for automotive, IoT, and other connected platforms PLANO, Texas – October 23, 2019 – Karamba Security, a world-leading provider of embedded cybersecurity for connected machines, today announced a ...

  • Closing the security gap left by conventional NOR Flash ICs

    In response to demand from security-conscious OEMs, the manufacturers of modern microcontrollers and systems-on-chip (SoCs) commonly equip their products with a broad range of security capabilities: standard, off-the-shelf 32-bit MCUs for mainstream, non-financial applications will today often featu...

  • Winbond Announces New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash ® memories support space-saving, cost-effective SO8 package Dual-Output SPI supports more...

  • Winbond announces new Flash Memory products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories o 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture o 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash® memories support space-saving, cost-effective SO8 package o Dual-Output SPI supports...

  • Winbond to Use Rambus Cryptography Research Division Security Measures to Safeguard Data Integrity

    Winbond to Use Rambus Cryptography Research Division Security Measures to Safeguard Data Integrity Hardware-based security technology will protect sensitive data and encrypted transactions in flash devices SUNNYVALE, Calif. – September 22, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced that Winbon...

  • [Re-scheduled] Winbond seminar- How innovation is bringing new value and new functionality to systems using code-storage Flash ICs

    Sorry, the seminar has been rescheduled and we will get back to you New Memory and Security Technologies for Designers of IoT Devices Designs for new connected devices of all types have to fulfil tough new requirements to succeed in a competitive market. In many cases, Internet of Things (IoT) edge ...

  • New 1.8V parts extend Winbond’s range of confidential and replay-protected Flash storage products for PCs’ UEFI variables and sensitive BIOS settings

    Winbond’s W25R SpiFlash family enables PC manufacturers to meet new mandated Windows 10 Hardware Compatibility Specification requirements TAICHUNG CITY, Taiwan – 11 October, 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the intr...

  • New Memory and Security Technologies for Designers of IoT Devices

    Internet of Things (IoT) edge nodes are battery-powered, often portable, and are connected to an internet gateway or access point wirelessly. This means that the most important constraints on new IoT designs are space, power and security. Check out how Winbond develops more power-efficient and secur...

  • Winbond TrustMe Secure Flash - A Robust and Certifiable Secure Storage Solution

    Winbond has introduced the TrustMe secure flash products to address the challenge of combining security with advanced process nodes and remove the barriers for adding secure non-volatile storage to practically any process node out there.

  • Winbond collaborate with DNP for the large density memory eSIM and Secure Element Development

    Tokyo, Japan and Taichung, Taiwan – 07 December 2018 -- Winbond Electronics Corporation (hereinafter: WB), a leading global supplier of semiconductor memory solutions in Taiwan, collaborates with Dai Nippon Printing Co., Ltd. (hereinafter: DNP) to increase the security level of IoT (Internet of Thin...

  • Code Storage Flash Memory - KGD

    Known Good Die (KGD) Several customers utilize Winbond’s expertise in using flash products in Known Good Die (KGD) for SIP (System In Package) solutions. Flash dies are stacked with Controller dies and put in a single package or module to provide SIP solutions. KGD of other devices can also be stack...

  • W25M121AV

    128Mb serial NOR and 1Gb serial NAND are assembled with single 8-pin package which NOR is default selected after power up. Easily boot up from NOR. Continuous Read Mode is defualt for NAND and Qual Read is default for NOR. Features [NOR] Single/Dual/Quad SPI operations Uniform 4KB erasable sectors &...

  • W25M121AW

    128Mb serial NOR and 1Gb serial NAND are assembled with single 8-pin package which NOR is default selected after power up. Easily boot up from NOR. Continuous Read Mode is defualt for NAND and Qual Read is default for NOR. Features [NOR] Single/Dual/Quad SPI and QPI operation Uniform 4KB erasable se...

  • W25M161AV

    16Mb serial NOR and 1Gb serial NAND are assembled with single 8-pin package which NOR is default selected after power up. Easily boot up from NOR. Continuous Read Mode is defualt for NAND and Qual Read is default for NOR. Features [NOR] Uniform 4KB erasable sectors & 32KB/64KB erasable blocks 8,192 ...

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